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Renesas Electronics

A Japanese semiconductor company supplying embedded processors, analog, power, connectivity and development-software solutions.

Last updated November 4, 2026

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Overview

Renesas Electronics Corporation is a Japanese semiconductor manufacturer headquartered in Tokyo. Its products include microcontrollers, microprocessors, automotive systems-on-chip, analog and mixed-signal devices, power-management components, connectivity products and software used to design and develop embedded systems. The company primarily serves automotive, industrial, infrastructure and Internet-of-Things applications, where long product lifecycles, functional safety, low power consumption, real-time performance and supply continuity are important. The modern Renesas organization began operations on April 1, 2010, when NEC Electronics merged with Renesas Technology. NEC Electronics was the surviving legal entity and adopted the Renesas Electronics name. Renesas Technology itself had been created in 2003 by combining the non-DRAM semiconductor businesses of Hitachi and Mitsubishi Electric. The brand name is derived from the expression “Renaissance Semiconductor for Advanced Solutions.” This lineage gave Renesas a broad collection of Japanese semiconductor technologies, including the 78K, V850, R8C, M16C, H8, RX and SuperH architectures. During its early years, Renesas faced severe operational, financial and manufacturing challenges. The 2011 Tōhoku earthquake and tsunami and flooding in Thailand disrupted factories and supply chains, while the company also carried a large and complex manufacturing footprint and overlapping product families. A restructuring supported by Japan’s state-backed Innovation Network Corporation of Japan helped stabilize the business. Renesas reduced its workforce, consolidated or sold facilities, and moved toward a more flexible fab-light manufacturing model that combines internal production with external foundries and outsourced assembly and testing. From the middle of the 2010s, acquisitions became central to Renesas’s strategy. Intersil expanded its analog and power portfolio; Integrated Device Technology broadened the company’s analog, mixed-signal, timing and data-center capabilities; Dialog Semiconductor added power-management, connectivity and low-power technologies; and Transphorm strengthened the company’s gallium-nitride power position. The 2024 acquisition of Altium added electronic-design software and supported Renesas’s effort to connect semiconductor products with system-development workflows. Other purchases, including Celeno Communications, Reality AI, Steradian Semiconductors and Panthronics, added wireless, edge-intelligence, radar and near-field-communication capabilities. Renesas’s principal MCU franchises include the low-power 16-bit RL78 family, the 32-bit RX family, the Arm Cortex-M-based RA family and the automotive RH850 family. Its R-Car automotive SoCs target advanced driver assistance, automated driving, digital cockpits, infotainment and vehicle gateways. The RZ processor family supports industrial human-machine interfaces, embedded vision, real-time control and industrial networking. Alongside these processors, the company sells analog, power, timing, connectivity and security products and provides software, development tools and reference designs. The company remains particularly important in automotive and industrial electronics. Its automotive portfolio combines real-time MCUs, high-performance SoCs, power devices, analog products and connectivity components so that customers can develop complete vehicle and industrial subsystems. In 2025, Renesas was described as the world’s third-largest MCU supplier and ranked fifth in automotive semiconductors by sales in 2024, with a reported 7% global share in that market. These rankings are market measurements rather than ownership or financial claims by the company itself. Renesas continues to adjust its technology and capital strategy. In 2025 it discontinued development of its own silicon-carbide power semiconductors and identified gallium nitride as a more concentrated investment area. The company also announced a…

History

Renesas’s corporate ancestry reaches back to semiconductor operations developed by Hitachi, Mitsubishi Electric and NEC. NEC separated its semiconductor activities into NEC Electronics on November 1, 2002, and the company was subsequently listed in Tokyo. In April 2003, Hitachi and Mitsubishi Electric combined their non-DRAM semiconductor operations to form Renesas Technology, owned 55% by Hitachi and 45% by Mitsubishi Electric. Their DRAM activities had been separated into Elpida Memory rather than included in Renesas Technology. In September 2009, NEC Electronics and Renesas Technology agreed to merge. The transaction took effect on April 1, 2010. NEC Electronics remained the legal survivor, changed its name to Renesas Electronics Corporation and began operating under the Renesas brand. The merger brought together multiple MCU and embedded-processor traditions, including NEC’s 78K and V850 families and Renesas Technology’s R8C, M16C, H8, RX and SuperH lines. The RL78 family subsequently combined elements of the NEC-originated 78K0R architecture with peripheral technologies from the 78K and Renesas R8C families. The new company struggled with excess manufacturing capacity, overlapping products and weak financial performance. The 2011 earthquake and tsunami in northeastern Japan and floods in Thailand caused substantial production and supply-chain disruption. Renesas responded with restructuring, workforce reductions and the sale or consolidation of facilities. In September 2013, a government-backed capital injection and third-party share allotment made the Innovation Network Corporation of Japan the company’s largest shareholder, with a 69.15% stake. The restructuring improved operating performance: for the year ended March 2014, Renesas reported operating income of ¥67.6 billion, compared with an operating loss of ¥23.2 billion in the prior year, while its net loss narrowed substantially. Renesas briefly pursued mobile semiconductors through Renesas Mobile, created in 2010 by combining its mobile business with wireless-modem assets acquired from Nokia. It later exited that area, transferring LTE assets to Broadcom in 2013 and absorbing Renesas Mobile in 2014. The company then concentrated more strongly on automotive, industrial and embedded applications. Beginning in 2017, acquisitions expanded Renesas beyond its traditional MCU base. Intersil added analog and power-management products. The 2019 acquisition of Integrated Device Technology, valued at approximately $6.7 billion, added analog, mixed-signal, timing, memory-interface and other technologies. Hidetoshi Shibata, previously the company’s chief financial officer, became president and CEO on July 1, 2019. Dialog Semiconductor was acquired in 2021 for approximately $6 billion, broadening Renesas’s power-management, connectivity and low-power semiconductor capabilities. Further acquisitions included Celeno Communications, Reality AI and Steradian Semiconductors. A fire at the Naka Factory in March 2021 temporarily interrupted production during the global automotive-chip shortage. Production resumed in stages from April. Renesas continued to broaden its portfolio through the acquisitions of Panthronics, Transphorm and Altium. The Altium transaction, announced in 2024 for approximately $5.9 billion, expanded the company into electronic-design software and later supported the Renesas 365 development platform. INCJ gradually reduced its ownership beginning in 2017 and sold its remaining Renesas shares in November 2023. The company also completed an approximately ¥200 billion share repurchase in June 2022. Renesas was added to the Nikkei 225 index in April 2023 and received the Global Semiconductor Alliance’s Outstanding Asia-Pacific Semiconductor Company Award in December 2022. In 2025, weaker demand led Renesas to announce a workforce reduction and defer salary increases. The company also changed its power-semiconductor priorities, ending development of its own SiC devices and emphasizing GaN. Renesas had entered a ten-year SiC wafer arrangement with Wolfspeed in 2023 and provided a $2 billion deposit. Wolfspeed’s 2025 Chapter 11 restructuring resulted in Renesas converting the deposit into other financial assets and recognizing a ¥236.6 billion loss related to the exposure. Renesas reported a ¥51.8 billion loss attributable to owners of the parent for 2025. In February 2026, Renesas agreed to transfer its IDT-originated timing business to SiTime for cash and shares. The transaction was completed on July 1, 2026. Renesas also pursued potential technical cooperation involving SiTime’s MEMS resonators and Renesas microcontrollers and SoCs. In parallel, its sustainability strategy set a 2040 carbon-neutrality target and a validated goal to reduce Scope 1 and Scope 2 emissions by 38% from 2021 levels by 2030.

  • 2026

    Timing business transferred to SiTime

    [1]

    Renesas completed the transfer of its timing business to SiTime.

  • 2025

    SiC strategy changes

    [1]

    Renesas ended development of its own SiC power semiconductors and emphasized GaN investment.

  • 2024

    Altium acquisition

    [1]

    Renesas expanded into electronic-design software through its acquisition of Altium.

  • 2023

    INCJ exits Renesas

    [1]

    INCJ sold its remaining Renesas shares, ending its ownership of the company.

  • 2022

    Share repurchase completed

    [1]

    Renesas completed an approximately ¥200 billion repurchase of its own shares.

  • 2021

    Dialog Semiconductor acquisition

    [1]

    Renesas acquired Dialog Semiconductor, expanding its power-management and connectivity portfolio.

  • 2019

    IDT acquisition and CEO transition

    [1]

    Renesas acquired IDT and Hidetoshi Shibata became president and CEO.

  • 2017

    Intersil acquisition

    [1]

    Renesas completed the acquisition of U.S. analog semiconductor company Intersil.

  • 2013

    INCJ becomes controlling shareholder

    [1]

    A third-party share allotment gave the state-backed Innovation Network Corporation of Japan a 69.15% stake.

  • 2010

    Renesas Electronics begins operations

    [1]

    NEC Electronics absorbed Renesas Technology and adopted the Renesas Electronics name.

Products and positioning

A broad embedded-semiconductor and system-development provider focused on automotive, industrial, infrastructure and IoT applications.

  • 16-bit microcontrollers · 2010

    RL78

    The RL78 family is a low-power 16-bit MCU platform introduced after the 2010 merger. It combines the NEC-originated 78K0R CPU core with peripheral technologies associated with the 78K and Renesas R8C families. Its variants support different instruction and processing capabilities, while features such as snooze mode allow selected peripherals to operate while the CPU is stopped.

  • 32-bit microcontrollers · 2009

    RX

    The RX family is a 32-bit MCU platform originally developed by Renesas Technology. The initial RX600 series targeted metering, motor control, human-machine interfaces, networking and industrial automation. Later RX families expanded toward lower-power and higher-performance applications.

  • Arm Cortex-M microcontrollers

    RA

    RA microcontrollers use Arm Cortex-M processor cores and are designed for embedded applications requiring a balance of performance, security, low power and software portability. Renesas supports the family with its Flexible Software Package and associated development tools.

  • automotive microcontrollers

    RH850

    RH850 is Renesas’s automotive MCU family for real-time vehicle-control systems such as powertrain, chassis and body electronics. Devices emphasize functional safety, reliability and security, with later versions adding multicore processing, motor control, automotive communications and safety features.

  • automotive systems-on-chip

    R-Car

    R-Car SoCs target advanced driver assistance, automated driving, infotainment, digital cockpits and vehicle gateways. The fifth-generation R-Car X5H, introduced in 2024, uses a 3 nm process and is intended to consolidate processing across several automotive domains.

  • embedded microprocessors

    RZ

    The RZ family comprises 32-bit and 64-bit processors for industrial and infrastructure applications. Subfamilies address high-resolution interfaces, embedded vision, real-time control, industrial Ethernet and networking, including RZ/A, RZ/G, RZ/T and RZ/N.

  • electronic-design software · 2026

    Renesas 365

    Renesas 365 is a digital development platform built around technology obtained through the Altium acquisition. It is intended to connect electronic-design workflows with Renesas semiconductor products, software and system-development resources.

Brand decisions

  • 2026

    Transfer timing business to SiTimeM&A

    Background

    The timing business originated in Renesas’s acquisition of IDT and was no longer central to the company’s desired portfolio structure.

    Action taken

    Renesas transferred the timing business to SiTime for approximately $1.5 billion in cash and about 4.13 million SiTime shares.

    Aftermath

    The transaction was completed on July 1, 2026, with the companies also exploring integration of SiTime MEMS resonators with Renesas processors.

    Consideration. Approximately $1.5 billion cash plus approximately 4.13 million SiTime shares (2026)

  • 2025

    Reprioritize power-semiconductor investmentStrategy

    Background

    Renesas reassessed its power-semiconductor roadmap amid market weakness and financial exposure to Wolfspeed.

    Action taken

    The company discontinued development of its own SiC power semiconductors and concentrated more investment on GaN.

    Aftermath

    Renesas recorded a ¥236.6 billion loss connected with its Wolfspeed exposure and continued repositioning its power portfolio.

    Loss related to Wolfspeed exposure. ¥236.6 billion (2025 financial statements)

  • 2024

    Acquire AltiumM&A

    Background

    Renesas aimed to extend its semiconductor business into electronic-design and system-development software.

    Action taken

    Renesas acquired Altium for approximately $5.9 billion.

    Aftermath

    Altium technology became part of the company’s broader digital-development strategy and Renesas 365 platform.

    Transaction value. Approximately $5.9 billion (2024)

  • 2021

    Acquire Dialog SemiconductorM&A

    Background

    Renesas wanted to expand in power management, connectivity and low-power semiconductor technologies.

    Action taken

    Renesas acquired Dialog Semiconductor for approximately $6 billion.

    Aftermath

    Dialog broadened Renesas’s portfolio and customer reach in mobile, industrial, automotive and IoT applications.

    Transaction value. Approximately $6 billion (2021)

  • 2019

    Acquire Integrated Device TechnologyM&A

    Background

    Renesas pursued a larger analog and mixed-signal portfolio and additional data-center and timing capabilities.

    Action taken

    Renesas acquired IDT in a transaction valued at approximately $6.7 billion.

    Aftermath

    IDT technologies expanded Renesas’s analog, timing and interface businesses; the timing operation was later transferred to SiTime.

    Transaction value. Approximately $6.7 billion (2019)

  • 2017

    Acquire IntersilM&A

    Background

    Renesas sought to reduce dependence on microcontrollers and strengthen analog and power-management offerings.

    Action taken

    The company acquired Intersil and integrated its analog semiconductor technologies.

    Aftermath

    The acquisition broadened Renesas’s product range for industrial, infrastructure and automotive customers.

  • 2013

    Accept state-backed recapitalizationStrategy

    Background

    Operational disruption, overlapping businesses and financial losses created a need for recapitalization and restructuring.

    Action taken

    Renesas issued shares through a third-party allotment that gave INCJ a 69.15% ownership position.

    Aftermath

    The company reduced its manufacturing footprint and improved operating performance before INCJ gradually sold its stake.

    Operating income. Operating loss of ¥23.2 billion → Operating income of ¥67.6 billion (Fiscal year ended March 2014 compared with the prior year)

  • 2010

    Merge NEC Electronics with Renesas TechnologyM&A

    Background

    The merger was intended to combine the semiconductor operations inherited from NEC, Hitachi and Mitsubishi Electric.

    Action taken

    NEC Electronics absorbed Renesas Technology and changed its name to Renesas Electronics Corporation.

    Aftermath

    The combined company inherited a broad portfolio of MCU architectures and manufacturing sites but subsequently faced major restructuring pressures.

Recent events

  • 2026

    Renesas transfers timing business to SiTime[1]

    M&A

    Renesas completed the transfer of its timing business to SiTime in a transaction involving cash and SiTime shares.

  • 2025

    Renesas announces restructuring and workforce reduction[1]

    Leadership change

    Renesas announced plans to reduce its global workforce by fewer than 1,000 positions and postponed scheduled regular salary increases amid weak semiconductor demand.

  • 2025

    Renesas ends development of its own silicon-carbide power semiconductors[1]

    Product generation

    The company discontinued internal development of its own SiC power semiconductors and identified gallium nitride as a technology for more concentrated investment.

  • 2025

    Wolfspeed restructuring affects Renesas financial exposure[1]

    Bankruptcy · Other

    After Wolfspeed entered Chapter 11 proceedings, Renesas recorded a large accounting loss connected with its Wolfspeed deposit and related financial assets.

  • 2024

    Renesas completes acquisition of Altium[3]

    M&A

    Renesas completed its acquisition of Altium, the electronic-system design software company, expanding its strategy from semiconductor components toward integrated hardware and software design workflows.

  • 2024

    Renesas announces leadership transition[3]

    Leadership change

    Renesas announced that Chris Allexandre would become president and chief executive officer in 2025, following the tenure of Hidetoshi Shibata.

  • 2024

    Renesas expands its embedded-system design strategy through Altium[3]

    M&A

    The Altium transaction positioned Renesas to offer closer integration between semiconductor selection, electronic design, printed-circuit-board development, and system-level engineering.

  • 2021

    Renesas completes acquisition of Dialog Semiconductor[3]

    M&A

    The acquisition added power-management, Bluetooth Low Energy, configurable mixed-signal, and low-power technology to Renesas’s portfolio.

  • 2021

    Naka manufacturing plant fire disrupts semiconductor supply[3]

    Other

    A fire at Renesas’s Naka factory in Japan damaged production equipment and temporarily reduced automotive-chip capacity, contributing to wider supply-chain pressure in the vehicle industry.

  • 2019

    Renesas completes acquisition of Integrated Device Technology[3]

    M&A

    The transaction broadened Renesas’s offerings in timing, interface, memory-interface, radio-frequency, and automotive products.

Showing the 10 most recent.

Sources73 sources

  1. 1Renesas Electronicsen.wikipedia.org
  2. 2Renesas Electronics official websiterenesas.com
  3. 3Renesas completes acquisition of Altiumrenesas.com
  4. 4半导体行业整合潮持续 瑞萨电子宣布59亿美元收购苹果供应商Dialog_个股资讯_市场_中金在线sc.stock.cnfol.com
  5. 5尘埃落定 瑞萨电子完成收购Dialogfinance.sina.com.cn
  6. 6美光推出「技術應用支援計畫」 加速業界採用DDR5 - 科技chinatimes.com
  7. 7日本瑞萨12寸芯片生产线因火灾停产 全球汽车缺芯潮雪上加霜auto.sina.com.cn
  8. 8瑞萨、恩智浦等芯片制造商因汽车需求飙升而提高半导体价格finance.sina.com.cn
  9. 9瑞萨电子发布支持32位Arm Cortex-M微控制器RA产品家族的灵活配置软件包(FSP)重要更新tech.sina.com.cn
  10. 10瑞萨电子加速ADAS和自动驾驶技术开发推出先进的R-Car V3U ASIL D级片上系统finance.sina.com.cn
  11. 11瑞萨电子扩展GaN产品组合,率先推出面向AI数据中心和机器人应用的低压GaN FETfinance.sina.com.cn
  12. 12瑞萨电子推出16位通用RL78/G23, 扩充低功耗MCU RL78产品家族finance.sina.com.cn
  13. 13瑞萨电子推出32位RX23W微控制器,为IoT终端设备提供Bluetooth 5.0tech.sina.com.cn
  14. 14瑞萨电子推出采用Pmod接口的新型模块化物联网开发平台finance.sina.com.cn
  15. 15瑞萨电子推出符合JEDEC标准的精密温度传感器tech.sina.com.cn
  16. 16瑞萨电子推出符合JEDEC标准的精密温度传感器 适用于DDR5存储模块tech.sina.com.cn
  17. 17瑞萨电子推出基于Arm Cortex-M33的RA6M4 MCU产品群为物联网应用提供卓越性能和先进安全性finance.sina.com.cn
  18. 18瑞萨电子推出集成LIN输出接口的传感器信号调理芯片 适用于电动/混动汽车HVAC系统tech.sina.com.cn
  19. 19瑞萨电子推出面向高性能服务器和云服务应用的DDR5数据缓冲器tech.sina.com.cn
  20. 20瑞萨电子推出面向工业4.0、医疗和物联网传感器应用的先进信号调节器ICtech.sina.com.cn
  21. 21瑞萨电子推出全新32位RX72N和RX66N MCU,可同时实现设备控制与网络连接,适用于工业自动化设备tech.sina.com.cn
  22. 22瑞萨电子推出全新车用执行器和传感器控制MCUfinance.sina.com.cn
  23. 23瑞萨电子推出全新低功耗RL78原型开发板 简化IoT终端设备原型设计tech.sina.com.cn
  24. 24瑞萨电子推出全新汽车摄像头解决方案finance.sina.com.cn
  25. 25瑞萨电子推出全新I3C总线扩展产品tech.sina.com.cn
  26. 26瑞萨电子推出入门级MPU RZ/V2L,具备出色电源效率和高精度AI加速器finance.sina.com.cn
  27. 27瑞萨电子推出适用于工业与物联网应用的RA4M3 MCU产品群 扩展其Arm Cortex内核MCU产品家族finance.sina.com.cn
  28. 28瑞萨电子推出完整的电源和功能安全解决方案,适用于R-Car V3H ADAS摄像头系统finance.sina.com.cn
  29. 29瑞萨电子推出业界首款CMOS工艺集成化CDR 扩展其光通信产品组合,适用于PAM4应用finance.sina.com.cn
  30. 30瑞萨电子推出支持蓝牙5的32位MCU 扩充了基于Arm Cortex-M内核的RA产品家族tech.sina.com.cn
  31. 31瑞萨电子推出IP Utilities,强化IP授权业务,助力芯片开发finance.sina.com.cn
  32. 32瑞萨电子推出R-Car Gen3e CPU速度提升达20%finance.sina.com.cn
  33. 33瑞萨电子推出RX23E-A MCU入门套件 可对用于工业自动化和测量设备的模拟前端进行快速而准确的评估tech.sina.com.cn
  34. 34瑞萨电子推出RZ/V系列微处理器 搭载图像处理AI加速器,可实现低功耗和实时AI处理tech.sina.com.cn
  35. 35瑞萨电子宣布与贝特莱及中印云端达成战略合作共同拓展指纹识别应用市场tech.sina.com.cn
  36. 36瑞萨电子宣布与赛灵思合作,共同开发Versal ACAP参考设计tech.sina.com.cn
  37. 37瑞萨电子I3C总线扩展和SPD集线器产品通过ASPEED AST2600基板管理控制器认证finance.sina.com.cn
  38. 38瑞萨电子RX MCU成为率先通过NIST FIPS 140-2安全标准CMVP 3级认证的通用MCUfinance.sina.com.cn
  39. 39瑞萨推出支持蓝牙5(Bluetooth 5)的RE01B微控制器(MCU)finance.sina.com.cn
  40. 40瑞萨宣布59亿美元收购苹果供应商Dialog 分析人士称交易或遭审查finance.sina.com.cn
  41. 41瑞薩擴大規模 擬斥近60億美元收購戴樂格news.cnyes.com
  42. 42Chipmaker Dialog to be acquired for $5.9B by Renesas Electronics - SiliconANGLEsiliconangle.com
  43. 43IAR Systems Updates Functional Safety Tools for Renesas RL78 MCUsprnewswire.com
  44. 44LeddarTech Expands Renesas Collaborationbusinessghana.com
  45. 45LeddarTech inc.: LeddarTech Expands its Collaboration with Renesas to Accelerate Autonomous Driving and ADAS Developmentfinanznachrichten.de
  46. 46Renesas Acquires Celeno to Expand Connectivity Portfolioiconnect007.com
  47. 47Renesas Announces Buck-Boost DC/DC Converter with Ultra-Low Quiescent Current for Powering Sensors, MCUs, Wireless Devices, and Other Componentseejournal.com
  48. 48Renesas collaborates with Microsoft to Accelerate Connected Vehicle Developmenteejournal.com
  49. 49Renesas Completes Acquisition of Celenoiconnect007.com
  50. 50Renesas Completes Acquisition of Dialog Semiconductoriconnect007.com
  51. 51Renesas Electronics Corporation: Renesas Completes Acquisition of Dialog Semiconductorfinanznachrichten.de
  52. 52Renesas Electronics Introduces Low-Power RL78 Prototyping Board to Simplify IoT Endpoint Equipment Prototypingeejournal.com
  53. 53Renesas Electronics launches a new line of radiation-hardened devices for satellites | iTWireitwire.com
  54. 54Renesas Electronics Launches Industry’s First Radiation Hardened Single-Chip Synchronous Buck and Low Dropout Regulator for Satellite Power Applicationseejournal.com
  55. 55Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applicationseejournal.com
  56. 56Renesas Enters FPGA Market with the First Ultra-Low-Power, Low-Cost Family Addressing Low-Density, High-Volume Applicationseejournal.com
  57. 57Renesas Introduces Bluetooth Low Energy Module for Ultra-Low Power IoT Applicationseejournal.com
  58. 58Renesas Introduces Complete Power and Functional Safety Solution for R-Car V3H ADAS Camera Systems - CIEcieonline.co.uk
  59. 59Renesas Introduces DDR5 Data Buffer for High-Performance Server and Cloud Service Applicationseejournal.com
  60. 60Renesas Introduces Functional Safety over EtherCAT for 32-Bit RX Microcontrollers - CIEcieonline.co.uk
  61. 61Renesas Introduces Industry’s First Industrial Temperature Grade DDR5 and DDR4 Registered Clock Driverseejournal.com
  62. 62Renesas Introduces Innovative New “Lab on the Cloud” Environment That Provides Instant Access to Popular Application Solutionseejournal.com
  63. 63Renesas Introduces JEDEC-Compliant Precision Temperature Sensor for DDR5 Memory Moduleseejournal.com
  64. 64Renesas Introduces JEDEC-Compliant Precision Temperature Sensor for DDR5 Memory Modules - CIEcieonline.co.uk
  65. 65Renesas Introduces RA6T2 MCUs for Next-Generation Motor Control in Inverter Appliances, Building Automation and Industrial Driveseejournal.com
  66. 66Renesas Introduces RX23E-A MCU Starter Kit to Jumpstart Accurate Analog Evaluation for Industrial Automation and Measurement Equipmenteejournal.com
  67. 67Renesas Launches Automotive Actuator and Sensor Control MCUs for Evolving Edge Applications in Next-Generation E/E Architectureeejournal.com
  68. 68Renesas Launches High-Reliability Radiation-Hardened Plastic Portfolio For Satellites in Medium and Geosynchronous Earth Orbitseejournal.com
  69. 69Renesas Launches RX23W Module with Bluetooth for System Control and Wireless Communication on IoT Devices - CIEcieonline.co.uk
  70. 70Renesas Launches RX74M and RX74N Flagship 32-bit MCUs, First RX Family Built on 22nm Process and Featuring MRAMeejournal.com
  71. 71Renesas Unveils Integrated LIN Interface Sensor Signal Conditioner for Electric and Hybrid Electric Vehicle HVAC Systemseejournal.com
  72. 72Renesas Updates Popular R-Car V3H with Improved Deep Learning Performance for Latest NCAP Requirements Including Driver and Occupant Monitoring Systemseejournal.com
  73. 73RS Components introduces RX23E-A analogue front-end microcontrollers from Renesas for precision sensing and measurement applicationseejournal.com

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