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X-Fab

A global specialty semiconductor foundry focused on analog, mixed-signal, MEMS, high-voltage, and power-related manufacturing.

Last updated August 22, 2026

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Overview

X-Fab is a specialty semiconductor foundry group that manufactures analog and mixed-signal integrated circuits for fabless semiconductor companies and other technology customers. Rather than selling a broad portfolio of branded finished chips, the company provides wafer-fabrication services, process technologies, manufacturing support, and related design enablement. Its principal areas include automotive electronics, industrial systems, medical devices, consumer electronics, communications, sensor applications, and power management. The company traces its industrial roots to the restructuring of East Germany's former Kombinat Mikroelektronik Erfurt after German reunification. The original electronics conglomerate was privatized in 1992 and divided into separate businesses, including X-FAB Gesellschaft zur Fertigung von Wafern mbH and Thesys Gesellschaft für Mikroelektronik mbH. X-Fab subsequently developed through acquisitions and consolidation of semiconductor manufacturing assets in Europe, the United States, and Asia. Its early expansion included the purchase of a Texas Instruments wafer facility in Lubbock, Texas, and the acquisition of Thesys in 1999. Further additions included the former Zarlink wafer plant in Plymouth, the 1st Silicon operation in Sarawak, the foundry business of ZMD, the Itzehoe MEMS foundry, and assets of Altis Semiconductor in France. X-Fab's manufacturing network has historically included sites in Erfurt and Dresden in Germany, Itzehoe in Germany, Corbeil-Essonnes in France, Kuching in Sarawak, Malaysia, and Lubbock, Texas. These facilities have supported wafer sizes and process generations suited to specialty applications rather than leading-edge digital logic. Technologies have included CMOS, BiCMOS, silicon carbide-related power production, MEMS, high-voltage processes, and analog and mixed-signal platforms. The company serves customers that require long product lifecycles, specialized process features, automotive qualification, and dependable capacity for mature-node devices. The group has had a particularly close commercial relationship with Melexis, an automotive semiconductor supplier that has also been associated with X-Fab's ownership structure. Other customers and users of its manufacturing platforms have included companies in sensor, display, memory, interface, industrial, and medical electronics. X-Fab's geographic customer mix has historically been concentrated in Europe and the Middle East, with substantial business from Asia and a smaller but important North American contribution. X-Fab became publicly traded in France through an initial public offering in 2017. Its ownership has included Xtrion NV and Sarawak Technology Holdings, a company associated with the government of Sarawak. The company has continued investing in additional capacity and specialty processes. In 2022 it licensed a 130-nanometer silicon-germanium BiCMOS platform from the Leibniz Institute for High Performance Microelectronics. In 2023 it announced a planned investment of approximately $1 billion to expand production capacity across facilities in Europe, the United States, and Malaysia. X-Fab's strategic position is based on the growing need for automotive electrification, industrial sensing, power electronics, medical instrumentation, and other applications where analog and specialty semiconductor capabilities are more important than the smallest digital transistor dimensions.

History

X-Fab emerged from the reorganization of East Germany's semiconductor industry after reunification. The former Kombinat Mikroelektronik Erfurt was privatized in 1992 and divided into separate entities, including X-FAB Gesellschaft zur Fertigung von Wafern mbH and Thesys Gesellschaft für Mikroelektronik mbH. X-Fab became the manufacturing-focused business, while Thesys retained a separate position in the regional semiconductor sector. The group was later associated with the Belgian holding company Elex N.V. and with Melexis, which became an important customer and related shareholder in the broader corporate structure. The first major phase of X-Fab's expansion involved acquiring established semiconductor facilities rather than building an entirely new network from scratch. In 1999, the company purchased a wafer facility from Texas Instruments in Lubbock, Texas, and acquired Thesys, disposing of non-foundry activities as it concentrated on wafer manufacturing. In 2002, X-Fab added a former Zarlink wafer plant in Plymouth, United Kingdom. These transactions gave the group a broader geographic base and access to manufacturing capabilities serving international customers. A second expansion phase strengthened X-Fab's presence in Asia and diversified its process portfolio. In 2006, X-Fab merged with 1st Silicon, a semiconductor manufacturer in Sarawak, Malaysia. The Sarawak government received a substantial shareholding as part of the transaction. In 2007, X-Fab acquired the foundry business of ZMD, enabling ZMD to focus more closely on designing and developing analog and mixed-signal devices while X-Fab assumed responsibility for manufacturing activities. X-Fab subsequently adjusted its site portfolio. In December 2009, it sold its United Kingdom wafer plant to Plus Semi. In February 2011, Rudi De Winter joined the leadership team as co-chief executive officer and later became chief executive officer in 2014. Under this period of management, X-Fab continued to emphasize specialty manufacturing, long-lived analog and mixed-signal processes, and customer-specific production support. MEMS became an increasingly important part of the company's capabilities. In 2012, X-Fab acquired Itzehoe GmbH, a MEMS foundry that had originated as a spin-off from the Fraunhofer Institute for Silicon Technology. X-Fab maintained cooperation with the institute in chip-related work, while the Itzehoe facility expanded the group's ability to manufacture microelectromechanical devices. The site became fully owned by X-Fab in 2015. During the same period, the company's Lubbock operation collaborated with PowerAmerica on production of 150-millimeter silicon carbide wafers for power-electronics applications. In 2016, X-Fab acquired assets of Altis Semiconductor, adding a French facility and creating a six-site manufacturing network spanning Germany, France, Malaysia, and the United States. The network included CMOS and MEMS production in Germany, CMOS manufacturing in France and Malaysia, and CMOS and BiCMOS production in Texas. The company focused on process ranges associated with specialty and mature-node applications, including technologies extending from approximately 800 nanometers to 130 nanometers in the period described by the reference material. X-Fab entered public markets through a French initial public offering in 2017. Its ownership remained concentrated, with Xtrion NV and Sarawak Technology Holdings among the principal shareholders. Xtrion also held a majority position in Melexis, linking X-Fab's ownership structure with one of its most important customers. Sarawak Technology Holdings was wholly owned by the government of Sarawak. The ownership arrangements gave both major shareholders influence over board appointments. The company experienced a significant operational cybersecurity incident in July 2020. Following a Maze ransomware attack, X-Fab temporarily halted information-technology systems and production lines to reduce the risk of further damage. The incident demonstrated the operational sensitivity of semiconductor manufacturing, where production depends on tightly integrated digital systems, factory controls, and supply-chain processes. X-Fab continued to broaden its technology portfolio in the 2020s. In 2022, it licensed a 130-nanometer silicon-germanium BiCMOS platform from the Leibniz Institute for High Performance Microelectronics. In 2023, it announced an investment program of approximately $1 billion aimed at increasing capacity in Europe, the United States, and Malaysia. These initiatives aligned the company with demand from automotive electronics, electrification, industrial automation, sensors, medical equipment, and power-management applications. X-Fab's business remains centered on specialty foundry services rather than consumer-facing chip products, with its competitive proposition based on analog and mixed-signal expertise, MEMS manufacturing, high-voltage capabilities, mature-node reliability, and geographically distributed production.

  • 2023

    Capacity expansion program announced

    [1]

    X-Fab announced approximately $1 billion in planned capacity investment across its international factory network.

  • 2022

    130 nm SiGe BiCMOS platform licensed

    [1]

    X-Fab licensed a silicon-germanium BiCMOS platform from IHP for specialty semiconductor manufacturing.

  • 2020

    Maze ransomware disruption

    [1]

    The company temporarily stopped IT systems and production lines after a ransomware attack.

  • 2017

    French initial public offering

    [1]

    X-Fab completed an IPO in France and became publicly traded.

  • 2016

    Altis Semiconductor assets acquired

    [1]

    X-Fab added a French wafer facility and expanded its international production network.

  • 2012

    Itzehoe MEMS foundry acquired

    [1]

    The acquisition added a dedicated MEMS manufacturing business originating from Fraunhofer ISIT.

  • 2007

    ZMD foundry business acquired

    [1]

    X-Fab acquired ZMD's foundry activities, reinforcing its analog and mixed-signal manufacturing specialization.

  • 2006

    Merger with 1st Silicon

    [1]

    The merger added a major Malaysian production operation and brought the Sarawak government into the shareholder base.

  • 2002

    Plymouth wafer plant acquired

    [1]

    The acquisition of a former Zarlink wafer plant expanded X-Fab's European manufacturing footprint.

  • 1999

    Expansion into the United States and acquisition of Thesys

    [1]

    X-Fab acquired a Texas Instruments wafer facility in Lubbock and acquired Thesys while concentrating its activities on foundry manufacturing.

Products and positioning

A global specialty foundry for analog, mixed-signal, MEMS, automotive, industrial, medical, and high-voltage semiconductor applications.

  • Wafer foundry

    Analog and mixed-signal foundry services

    X-Fab manufactures analog and mixed-signal integrated circuits designed by fabless semiconductor companies and other customers. These services support functions such as sensing, signal conditioning, interface circuits, power management, and control. The offering emphasizes process longevity, specialized device options, automotive and industrial qualification, and manufacturing continuity rather than the most advanced digital logic geometries.

  • Semiconductor process technology

    CMOS process platforms

    X-Fab operates CMOS technologies across mature and specialty process nodes for automotive, industrial, consumer, and medical applications. Its sites have supported production on 200-millimeter wafers in Europe and Malaysia and on 150-millimeter wafers in Texas. The platforms are designed for products that require embedded analog functions, high reliability, long availability, or specialized voltage and sensor features.

  • Semiconductor process technology · 2022

    SiGe BiCMOS platforms

    The company's BiCMOS capabilities combine bipolar devices with CMOS circuitry for applications requiring high performance, analog precision, radio-frequency characteristics, or power handling. In 2022, X-Fab licensed a 130-nanometer silicon-germanium BiCMOS platform from IHP, extending its specialty technology portfolio.

  • Microelectromechanical systems · 2012

    MEMS foundry services

    X-Fab provides manufacturing for microelectromechanical systems, including sensor and actuator structures integrated with semiconductor production capabilities. The company's MEMS activities were strengthened by the acquisition of Itzehoe GmbH, a business originating from Fraunhofer ISIT. MEMS manufacturing supports industrial, automotive, medical, and other sensing applications.

  • Power semiconductor manufacturing

    High-voltage and power technologies

    X-Fab manufactures specialty processes for high-voltage and power-related applications. These technologies are relevant to automotive electronics, motor control, power management, industrial equipment, and electrification systems. The company has also worked on silicon carbide wafer production for power electronics through its collaboration with PowerAmerica.

  • Automotive semiconductor manufacturing

    Automotive semiconductor platforms

    X-Fab's automotive-oriented foundry services address sensors, driver systems, power management, interfaces, and other vehicle electronics. The segment benefits from the company's emphasis on mature, qualified processes and long product lifecycles. Automotive demand is a central part of X-Fab's relationship with customers such as Melexis and other fabless semiconductor suppliers.

Controversies

  • 2020

    Maze ransomware attack

    X-Fab temporarily halted IT systems and production lines in July 2020 after a Maze ransomware attack. The shutdown was a protective response intended to prevent the incident from causing wider damage to manufacturing operations.

Read more

Marketing campaigns

  • 2015PowerAmerica silicon carbide manufacturing collaboration

    United States · Power electronics

    X-Fab's Lubbock facility worked with PowerAmerica, a Manufacturing USA research institute, on producing 150-millimeter silicon carbide wafers for power-electronics applications.

    Outcome. The collaboration supported X-Fab's expansion into silicon carbide-related power semiconductor manufacturing.

Brand decisions

  • 2023

    Announce a global capacity expansion programStrategy

    Background

    Growth in automotive, industrial, medical, power, and sensor electronics increased the need for specialty foundry capacity.

    Action taken

    X-Fab announced an approximately $1 billion investment program covering factories in Europe, the United States, and Malaysia.

    Aftermath

    The program positioned the company to increase manufacturing capacity across its established international network.

    Announced investment. $1 billion (2023 announcement)

  • 2022

    License a 130 nm SiGe BiCMOS platformProduct launch

    Background

    Demand for specialty analog, radio-frequency, automotive, and high-performance mixed-signal technologies encouraged expansion of X-Fab's process portfolio.

    Action taken

    X-Fab licensed a 130-nanometer silicon-germanium BiCMOS platform from IHP.

    Aftermath

    The agreement added a new specialty process option to X-Fab's foundry technology offering.

  • 2017

    Complete a French initial public offeringOther

    Background

    X-Fab required access to public equity markets while maintaining strategic shareholders with substantial ownership positions.

    Action taken

    The company listed shares in France and made a portion of its equity available to public investors.

    Aftermath

    X-Fab became a publicly traded specialty foundry, while Xtrion and Sarawak-related shareholders remained influential owners.

  • 2016

    Acquire Altis Semiconductor assetsM&A

    Background

    X-Fab was expanding capacity and geographic coverage for specialty semiconductor manufacturing in Europe.

    Action taken

    The group acquired assets of Altis Semiconductor, including its French manufacturing facility.

    Aftermath

    The transaction added France as a major location in X-Fab's production network.

  • 2012

    Acquire Itzehoe MEMS foundryM&A

    Background

    X-Fab sought to broaden its specialty manufacturing portfolio beyond conventional CMOS and analog processes.

    Action taken

    It acquired Itzehoe GmbH, a MEMS foundry associated with Fraunhofer ISIT.

    Aftermath

    The acquisition expanded X-Fab's MEMS manufacturing capabilities and eventually resulted in full ownership of the facility.

  • 2009

    Sell the United Kingdom wafer plantStrategy

    Background

    X-Fab adjusted its international site portfolio after expanding through several acquisitions.

    Action taken

    The company sold its United Kingdom wafer plant to Plus Semi.

    Aftermath

    The disposal reduced X-Fab's direct manufacturing presence in the United Kingdom while retaining its broader international network.

  • 1999

    Acquire Thesys and focus on foundry manufacturingM&A

    Background

    X-Fab was consolidating its position as a semiconductor manufacturing specialist after the breakup of East Germany's former electronics conglomerate.

    Action taken

    It acquired Thesys and disposed of non-foundry activities to concentrate on wafer fabrication.

    Aftermath

    The transaction reinforced X-Fab's identity as a dedicated specialty foundry.

Recent events

  • 2026

    X-Fab shares show sharp volatility after an online investment post[1]

    Pricing · Other

    A viral post on the social network X presented X-Fab as an investment opportunity connected with photonics, artificial intelligence, and power semiconductors. The shares reportedly rose sharply during the session before giving back part of the move, without a corresponding major company announcement.

  • 2023

    X-Fab announces approximately $1 billion capacity investment[1]

    Other

    X-Fab announced a large-scale investment program intended to increase production capacity across factories in Europe, the United States, and Malaysia.

  • 2022

    X-Fab licenses a 130 nm SiGe BiCMOS platform from IHP[1]

    Product launch · Product generation

    X-Fab licensed a 130-nanometer silicon-germanium BiCMOS technology platform from the Leibniz Institute for High Performance Microelectronics.

  • 2017

    X-Fab completes an initial public offering in France[1]

    Other

    X-Fab listed shares in France, making a portion of its equity available to public investors while existing major shareholders retained substantial stakes.

  • 2016

    X-Fab acquires Altis Semiconductor assets[1]

    M&A

    The purchase of Altis Semiconductor assets added a French manufacturing site and expanded X-Fab's European production footprint.

  • 2015

    X-Fab cooperates with PowerAmerica on silicon carbide wafers[1]

    Campaign · Product launch

    The Lubbock facility collaborated with PowerAmerica on production of 150-millimeter silicon carbide wafers for power-electronics applications.

  • 2015

    X-Fab acquires full ownership of the Itzehoe MEMS foundry[1]

    M&A

    The Itzehoe operation became fully owned by X-Fab, consolidating the group's MEMS manufacturing activities.

  • 2012

    X-Fab expands into MEMS through Itzehoe acquisition[1]

    M&A · Product generation

    X-Fab acquired MEMS foundry Itzehoe GmbH, strengthening its ability to manufacture microelectromechanical devices.

  • 2011

    Rudi De Winter joins X-Fab's executive leadership[1]

    Leadership change

    Rudi De Winter was appointed co-chief executive officer and later became chief executive officer.

  • 2009

    X-Fab sells its United Kingdom wafer plant[1]

    M&A

    X-Fab sold its United Kingdom wafer facility to Plus Semi, ending its direct ownership of that site.

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