Tongfu Microelectronics
A Chinese outsourced semiconductor assembly and test provider focused on advanced packaging and testing for computing, automotive, new-energy, and memory applications.
Last updated October 13, 2026
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Overview
Tongfu Microelectronics is a Chinese semiconductor manufacturing-services company headquartered in Nantong, Jiangsu. Its principal business is outsourced semiconductor assembly and test, commonly abbreviated OSAT: the packaging, assembly, reliability processing, and electrical testing of integrated circuits after wafer fabrication. The company is regarded as one of the larger OSAT participants in mainland China and serves semiconductor customers that require production-scale back-end manufacturing rather than wafer fabrication itself. The organization traces its roots to Nantong Transistor Factory, a state-owned enterprise established in 1966 to manufacture transistors. During the reform and opening-up period, increasing competition from overseas products placed substantial pressure on the factory. By the end of the 1980s it was reportedly among Nantong's weakest industrial enterprises and was close to bankruptcy. In 1990, Shi Mingda, a Nanjing University graduate and long-serving employee who had become the factory manager, worked with other employees to acquire and restructure the business. The restructured entity was named Nantong Huada Microelectronics. Nantong Huada began cooperating with Fujitsu in 1994. The relationship initially centered on technology transfer and the assembly of logic products, including microcontrollers and linear integrated circuits used in consumer electronics. Rather than immediately forming a joint venture, Fujitsu first pursued a partnership model. In 1997, the two companies established Nantong Fujitsu Microelectronics, with Nantong Huada holding 60 percent and Fujitsu 40 percent. The joint venture concentrated on integrated-circuit assembly and testing and became the principal corporate platform from which the later Tongfu business developed. On 16 August 2007, Nantong Fujitsu Microelectronics completed an initial public offering and became listed on the Shenzhen Stock Exchange. A major international expansion followed in 2015, when AMD agreed to transfer the majority of its interests in semiconductor manufacturing operations in Suzhou, China, and Penang, Malaysia, to a new venture controlled by Nantong Fujitsu Microelectronics. The transaction was valued at $371 million according to the cited reference material. The proposed ownership structure gave Nantong Fujitsu 85 percent and AMD 15 percent, while approximately 1,700 AMD employees at the two sites were expected to move to the joint venture. In December 2016, the listed company changed its name from Nantong Fujitsu Microelectronics to Tongfu Microelectronics and removed the Fujitsu name from its corporate identity. In 2018, Fujitsu sold its remaining holdings in Tongfu to several Chinese stakeholders, including the China Integrated Circuit Industry Investment Fund, as part of a change in Fujitsu's business strategy. The ownership transition further aligned the company with China's domestic semiconductor ecosystem. Tongfu's present positioning is based on manufacturing depth, international production capacity, and the development of increasingly sophisticated package and test technologies. Its stated focus includes advanced packaging for high-performance computing, new-energy systems, automotive electronics, and memory. In May 2024, reports described cooperation between Tongfu and ChangXin Memory Technologies on high-bandwidth-memory production intended to reduce dependence on foreign supply chains. Reporting in January 2025 stated that Tongfu had begun production connected with that effort. The company therefore occupies an important back-end position in China's semiconductor supply chain, although the available reference material does not establish a complete current product catalog, detailed financial profile, or full list of active facilities.
History
Tongfu Microelectronics developed from Nantong Transistor Factory, a state-owned transistor producer established in 1966 in Nantong, Jiangsu. The factory's original business was based on discrete semiconductor production, but its competitive position deteriorated during China's reform and opening-up period as overseas products entered the market. By the late 1980s, the enterprise was in severe financial difficulty and reportedly close to bankruptcy. A restructuring began in 1990 under Shi Mingda, a Nanjing University graduate who had worked at the factory for many years and had become its manager. Shi and several other employees acquired the troubled business and converted it into a joint-stock enterprise named Nantong Huada Microelectronics. This transition moved the organization away from its earlier state-owned-factory model and created the basis for later participation in integrated-circuit back-end manufacturing. In 1994, Nantong Huada entered into a cooperation arrangement with Fujitsu. Fujitsu transferred technology for the assembly of logic devices, including microcontrollers and linear integrated circuits used in consumer electronics. The parties initially considered a joint venture, but Fujitsu first preferred a partnership to evaluate the relationship. In 1997, they established Nantong Fujitsu Microelectronics, with Nantong Huada holding 60 percent and Fujitsu 40 percent. The joint venture assembled and tested integrated circuits and connected the Chinese company to an international semiconductor production network. Nantong Fujitsu Microelectronics became a public company through an initial public offering on 16 August 2007, listing on the Shenzhen Stock Exchange. Its growth strategy subsequently expanded beyond the original Fujitsu relationship. In October 2015, AMD agreed to sell the majority of its interests in manufacturing operations in Suzhou and Penang to Nantong Fujitsu. The proposed transaction involved a new joint venture owned 85 percent by Nantong Fujitsu and 15 percent by AMD, with about 1,700 AMD employees transferring to the venture. The reported value was $371 million. The company adopted the Tongfu Microelectronics name in December 2016 and removed Fujitsu from its branding. In 2018, Fujitsu sold its remaining interests to several Chinese stakeholders, including the China Integrated Circuit Industry Investment Fund. This ownership change reflected Fujitsu's revised business strategy and reinforced Tongfu's place within China's domestic semiconductor-investment framework. In its current form, Tongfu is an OSAT company. Its activities cover semiconductor packaging, assembly, and testing, with development efforts directed toward advanced packages and application areas such as high-performance computing, new-energy systems, automotive electronics, and memory. The company also has an international operating footprint associated with its Chinese and Malaysian manufacturing activities. In 2024, reports identified cooperation with ChangXin Memory Technologies on high-bandwidth memory, a class of memory used in demanding computing applications. The reported objective was to reduce reliance on overseas suppliers, and January 2025 reports said production had begun. The available reference material does not provide enough information to document every facility, package technology, financial result, or current executive appointment, so those areas require further verification.
- 2025
High-bandwidth-memory production reported to have begun
[1]January reports stated that Tongfu had started production related to the high-bandwidth-memory project.
- 2024
High-bandwidth-memory cooperation reported
[1]Tongfu was reported to be working with ChangXin Memory Technologies on high-bandwidth-memory production.
- 2018
Fujitsu exits its holdings
[1]Fujitsu sold its holdings to Chinese stakeholders, including the China Integrated Circuit Industry Investment Fund.
- 2016
Corporate name changed to Tongfu Microelectronics
[1]The company removed the Fujitsu name and adopted its current Tongfu Microelectronics identity.
- 2015
AMD manufacturing-operations transaction announced
[1]AMD agreed to transfer majority interests in its Suzhou and Penang operations to a joint venture controlled by Nantong Fujitsu Microelectronics.
- 2007
Initial public offering
[1]Nantong Fujitsu Microelectronics completed its IPO on 16 August and became listed on the Shenzhen Stock Exchange.
- 1997
Nantong Fujitsu Microelectronics joint venture formed
[1]Nantong Huada and Fujitsu established a 60/40 joint venture for integrated-circuit assembly and testing.
- 1994
Technology cooperation with Fujitsu begins
[1]Nantong Huada and Fujitsu began cooperating on the assembly of logic chips, including microcontrollers and linear integrated circuits.
- 1990
Troubled factory restructured as Nantong Huada Microelectronics
[1]Shi Mingda and other employees acquired and restructured the financially distressed factory as a joint-stock company named Nantong Huada Microelectronics.
- 1966
Nantong Transistor Factory established
[1]The state-owned Nantong Transistor Factory was established to produce transistors, providing the institutional roots of the later Tongfu Microelectronics business.
Products and positioning
A large mainland Chinese OSAT provider combining domestic semiconductor-industry integration with international manufacturing operations. Tongfu emphasizes advanced packaging and testing for high-performance computing, automotive electronics, new-energy applications, and memory, while its historical relationship with Fujitsu and AMD gives it experience serving global semiconductor production networks.
OSAT services
Integrated-circuit assembly and test
Tongfu's core business is outsourced semiconductor assembly and testing. It receives semiconductor devices after wafer fabrication and performs packaging, assembly, electrical testing, and related production processes before shipment to customers. This model allows chip designers and wafer manufacturers to outsource back-end manufacturing rather than operate all packaging and test capacity themselves.
Advanced packaging
Advanced semiconductor packaging
The company develops and produces advanced packaging intended for demanding applications, including high-performance computing, automotive electronics, new-energy systems, and memory. The reference material does not specify individual package names or process nodes, but identifies advanced packaging as a strategic focus of the business.
Logic semiconductors · 1994
Logic-device assembly and test
The company's earlier cooperation with Fujitsu involved assembly of logic products such as microcontrollers and linear integrated circuits for consumer electronics. This work helped establish Tongfu's experience in integrated-circuit back-end manufacturing.
Memory semiconductors · 2024
High-bandwidth-memory manufacturing
Tongfu was reported to be cooperating with ChangXin Memory Technologies on high-bandwidth-memory semiconductors. The project is associated with China's effort to strengthen domestic supply for advanced computing memory and was reported to have entered production in January 2025.
Controversies
Brand decisions
2024
Cooperation on high-bandwidth-memory productionProduct launchBackground
Tongfu and ChangXin Memory Technologies were reported to be developing high-bandwidth-memory manufacturing capacity to reduce reliance on foreign supply.
Action taken
The companies partnered on production of high-bandwidth-memory semiconductors for advanced computing applications.
Aftermath
January 2025 reports said Tongfu had begun production connected with the cooperation, although the available reference does not provide production volumes or commercial customer details.
2018
Fujitsu divested its Tongfu holdingsM&ABackground
Fujitsu changed its business strategy and decided to sell its investment in Tongfu.
Action taken
Fujitsu sold its holdings to several Chinese stakeholders, including the China Integrated Circuit Industry Investment Fund.
Aftermath
The ownership transition strengthened Tongfu's alignment with Chinese semiconductor-industry investors.
2016
Rebranded as Tongfu MicroelectronicsStrategyBackground
Following the development of the business beyond its original Fujitsu joint-venture identity, the company changed its corporate name.
Action taken
Nantong Fujitsu Microelectronics adopted the Tongfu Microelectronics name and removed Fujitsu branding.
Aftermath
The rebrand established the current corporate identity used by the listed semiconductor packaging and testing company.
2015
Pursued AMD's Suzhou and Penang manufacturing operationsM&ABackground
Nantong Fujitsu Microelectronics sought to expand its OSAT and international manufacturing footprint through AMD's divestment of majority interests in operations in Suzhou and Penang.
Action taken
The proposed structure placed 85 percent of the new joint venture with Nantong Fujitsu Microelectronics and 15 percent with AMD, with approximately 1,700 employees transferring to the venture.
Aftermath
The transaction broadened the company's international operating platform and connected it more directly with AMD's semiconductor manufacturing network.
Reported transaction value. $371 million (2015 announced transaction)
Recent events
- 2025
Reports said Tongfu began high-bandwidth-memory production[1]
Product generation · Other
January reporting stated that Tongfu had started production related to its high-bandwidth-memory cooperation with ChangXin Memory Technologies.
- 2024
Tongfu and ChangXin Memory Technologies reported cooperation on high-bandwidth memory[1]
Product launch · Other
Reports described a partnership to produce high-bandwidth-memory semiconductors and strengthen domestic alternatives to foreign supply.
- 2018
Fujitsu sold its holdings in Tongfu Microelectronics[1]
M&A
Fujitsu disposed of its holdings to several Chinese stakeholders, including the China Integrated Circuit Industry Investment Fund, following a change in business strategy.
- 2016
Nantong Fujitsu Microelectronics adopted the Tongfu Microelectronics name[1]
Other
The company changed its corporate name and removed the Fujitsu branding as part of its post-joint-venture identity.
- 2015
AMD agreed to transfer majority interests in Suzhou and Penang manufacturing operations to Nantong Fujitsu Microelectronics[1]
M&A
The proposed $371 million transaction would place the operations in a joint venture controlled 85 percent by Nantong Fujitsu Microelectronics and 15 percent by AMD. Approximately 1,700 AMD employees were expected to join the venture.
Sources4 sources
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