Systems on Silicon Manufacturing

Systems on Silicon Manufacturing Company Pte. Ltd., commonly known as SSMC, is a Singaporean semiconductor fabrication company and joint venture associated with NXP Semiconductors and Taiwan Semiconductor Manufacturing Company (TSMC). It operates a wafer-fabrication facility in Pasir Ris Wafer Fab Park, Singapore, supplying semiconductor manufacturing services for applications that require established, specialized process technologies rather than the most advanced leading-edge logic nodes. The company traces its origins to a joint venture formed by Philips Semiconductors and TSMC, with EDB Investments also involved during the company’s establishment. SSMC was founded in December 1998 and incorporated in 1999. Its main fabrication plant was constructed between 2000 and 2001, with the facility designed to support high-volume wafer production. The site was reported to have a gross floor area of approximately 90,000 square metres and an initial output capacity of about 30,000 wafers per month. SSMC’s technology portfolio has included process nodes from approximately 0.25 micron to 0.14 micron. These processes support a range of products and functions, including conventional logic, embedded flash memory, mixed-signal circuits, radio-frequency devices and other specialty semiconductor applications. The company also provides manufacturing-related technical support and commercial advice intended to help customers manage semiconductor production and associated business processes. As demand in the semiconductor industry changed, SSMC repeatedly upgraded its equipment, process capabilities and production facilities. In 2006, NXP and TSMC increased their respective holdings by acquiring shares previously held by EDB Investments. This established the ownership structure under which NXP held 61.2% and TSMC held 38.8%, according to the cited reference material. In 2007, SSMC established a research and development centre focused on specialized process development and markets such as automotive semiconductors, near-field communication and radio-frequency products. The company subsequently adjusted its product emphasis. In 2010, it shifted attention away from a stronger focus on chips for consumer devices such as smartphones and laptops and toward high-performance mixed-signal, or HPMS, semiconductors. These products were described as serving applications including biometric passports and other technology systems intended for practical, everyday uses. Production capacity also expanded over time. By 2010, the facility’s reported monthly capacity had increased to approximately 53,000 wafers. In late 2018, SSMC announced or undertook a further expansion of its automotive and specialty-chip footprint in Singapore, adding a clean-room area of about 4,400 square metres as part of an investment reported at S$300 million. SSMC’s business is therefore best understood as a specialty semiconductor manufacturing platform rather than a consumer-facing chip brand. Its role is to manufacture integrated circuits for customers across automotive, identification, connectivity, radio-frequency, mixed-signal and other industrial or embedded applications. The company’s Singapore location, process specialization and relationship with NXP and TSMC are central to its identity.

Systems on Silicon Manufacturing originated in a semiconductor joint venture formed by Philips Semiconductors and Taiwan Semiconductor Manufacturing Company, with EDB Investments participating in the company’s early ownership structure. The company was founded in December 1998 and incorporated in 1999. Its creation reflected Singapore’s effort to develop a substantial semiconductor manufacturing base and the partners’ interest in combining local industrial infrastructure with the process and manufacturing expertise of established semiconductor companies. SSMC’s principal manufacturing facility was built at Pasir Ris Wafer Fab Park. Construction began in 2000 and the plant was completed by 2001. The facility was reported to have a gross floor area of approximately 90,000 square metres and an initial manufacturing capacity of around 30,000 wafers per month. Rather than positioning itself solely around the newest digital logic technologies, SSMC developed capabilities across established and specialty process ranges. Its technologies included approximately 0.25-micron through 0.14-micron processes supporting logic, embedded flash memory, mixed-signal circuits and RF applications. The company’s manufacturing role was accompanied by technical and commercial support services. These services helped customers address production requirements and related business-process needs. Like other semiconductor foundries, SSMC’s investment priorities and product mix were influenced by cyclical changes in global chip demand. The company consequently upgraded its equipment and manufacturing capabilities as customer requirements evolved. A significant ownership change occurred in 2006. NXP Semiconductors, which had succeeded Philips’ semiconductor business, and TSMC purchased shares held by EDB Investments. Following that transaction, the reported ownership split was 61.2% for NXP and 38.8% for TSMC. The change connected SSMC more directly to the corporate structures and semiconductor manufacturing networks of both companies. In 2007, SSMC created an R&D centre for specialized manufacturing-process development. The centre’s areas of interest included automotive semiconductors, near-field communication and radio-frequency applications. This development complemented the company’s existing mixed-signal and embedded-memory capabilities and broadened its relevance beyond general-purpose consumer electronics. By 2010, SSMC’s reported monthly production capacity had reached approximately 53,000 wafers. That year also marked a stated shift in strategic emphasis. The company moved away from a stronger orientation toward chips used in smartphones and laptops and concentrated more on high-performance mixed-signal semiconductors. The cited applications included biometric passports and other systems designed to address practical technology needs. This direction was consistent with SSMC’s focus on specialty processes, where long product lifecycles, analog-digital integration, RF performance and application-specific requirements can be more important than minimum feature size. SSMC continued expanding its specialty and automotive manufacturing capabilities in Singapore. In late 2018, it added a clean-room area of approximately 4,400 square metres through an expansion reported to cost S$300 million. The expansion increased the company’s ability to serve automotive and other specialty-chip markets. The available reference material does not identify a separate consumer product brand, publicly traded listing, or named individual executive leadership team for SSMC. Its identity is primarily that of a business-to-business semiconductor foundry. The company’s historical significance lies in its role in Singapore’s wafer-fabrication industry, its partnership structure involving NXP and TSMC, and its continuing specialization in mature-node and specialty technologies such as mixed signal, RF, embedded flash and automotive semiconductor manufacturing.

• 2018

  Automotive and specialty expansion

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  SSMC expanded its Singapore footprint with a reported S$300 million investment and approximately 4,400 square metres of additional clean-room space.

• 2010

  Capacity and strategic focus expand

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  Reported monthly capacity reached approximately 53,000 wafers, while the company placed greater emphasis on high-performance mixed-signal products.

• 2007

  Research and development centre established

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  SSMC established an R&D centre focused on specialized manufacturing processes and automotive, NFC and RF applications.

• 2006

  NXP and TSMC increase ownership

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  NXP and TSMC acquired EDB Investments’ shares, resulting in reported holdings of 61.2% and 38.8%, respectively.

• 2001

  Main fabrication plant completed

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  The main plant was completed, with reported initial output of approximately 30,000 wafers per month.

• 2000

  Wafer-fab construction begins

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  Construction began on SSMC’s principal wafer-fabrication plant at Pasir Ris Wafer Fab Park.

• 1999

  Company incorporated

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  The company was incorporated as Systems on Silicon Manufacturing Company Pte. Ltd. in Singapore.

• 1998

  Joint venture founded

  [1]Systems on Silicon Manufacturingen.wikipedia.org

  Systems on Silicon Manufacturing was founded in December as a semiconductor manufacturing joint venture associated with Philips Semiconductors, TSMC and EDB Investments.

A Singapore-based specialty foundry focused on mature-node, mixed-signal, RF, embedded-memory and automotive semiconductor manufacturing for business customers.

• Logic manufacturing

  Logic semiconductor processes

  SSMC’s process portfolio includes established-node logic manufacturing capabilities. These processes are intended for customer-designed integrated circuits where reliable production, process maturity and integration with other functions can be more important than leading-edge transistor density.

• Embedded memory

  Embedded flash processes

  The company supports embedded flash manufacturing, allowing non-volatile memory to be integrated into semiconductor devices alongside logic and other circuit functions. Such processes are relevant to identification, control, automotive and embedded-system applications.

• Mixed-signal manufacturing · 2010

  Mixed-signal semiconductor processes

  SSMC manufactures mixed-signal devices that combine analog and digital circuitry. Its later emphasis on high-performance mixed-signal, or HPMS, products reflects demand from systems that must connect digital processing with real-world signals, sensors, identification functions and communications interfaces.

• RF and connectivity semiconductors

  RF and NFC processes

  SSMC’s specialty capabilities include radio-frequency and near-field communication-related manufacturing. These technologies support wireless identification, short-range communications and other applications that require controlled RF performance and integration with digital or memory functions.

• Automotive semiconductors · 2007

  Automotive semiconductor manufacturing

  Automotive semiconductor manufacturing became an important development area for SSMC’s R&D and capacity investments. The company’s specialty process orientation is suited to automotive components that require established production technologies, mixed-signal functionality and long-term supply support.

• 2018

  Expansion of automotive and specialty-chip capacityStrategy

  Background

  Demand for automotive and specialty semiconductors supported further investment in SSMC’s Singapore manufacturing operations.

  Action taken

  SSMC expanded its footprint with approximately 4,400 square metres of additional clean-room space in a project reported to cost S$300 million.

  Aftermath

  The expansion increased the company’s capacity to support automotive and other specialty semiconductor customers.

  Reported expansion investment. S$300 million (2018)

  Source

• 2010

  Shift toward high-performance mixed-signal manufacturingStrategy

  Background

  SSMC’s product mix was affected by changing demand in the semiconductor industry, including demand for chips used in smartphones and laptops.

  Action taken

  The company shifted strategic emphasis toward high-performance mixed-signal semiconductor chips, including applications such as biometric passports.

  Aftermath

  The shift reinforced SSMC’s positioning as a specialty foundry serving mixed-signal, identification, RF and other application-oriented markets.

  Source

• 2006

  Consolidation of joint-venture ownershipM&A

  Background

  EDB Investments held shares in SSMC during the company’s early development, while Philips’ semiconductor business had become part of the NXP corporate structure.

  Action taken

  NXP Semiconductors and TSMC purchased shares held by EDB Investments, producing a reported ownership split of 61.2% for NXP and 38.8% for TSMC.

  Aftermath

  The transaction gave NXP and TSMC direct control of the joint venture’s ownership structure and aligned SSMC more closely with their semiconductor businesses.

  Source

• 2018

  SSMC expands automotive and specialty semiconductor clean-room capacity[1]Systems on Silicon Manufacturingen.wikipedia.org

  Other

  SSMC expanded its Singapore manufacturing footprint with a reported S$300 million investment and an additional clean-room area of approximately 4,400 square metres.

• 2018

  SSMC expands automotive and specialty-chip clean-room capacity[1]Systems on Silicon Manufacturingen.wikipedia.org

  Other · Product generation

  SSMC expanded its Singapore manufacturing footprint with a new clean-room area of approximately 4,400 square metres for automotive and specialty semiconductor production.

• 2010

  SSMC shifts emphasis toward high-performance mixed-signal manufacturing[1]Systems on Silicon Manufacturingen.wikipedia.org

  Product generation

  The company redirected part of its focus from chips used in smartphones and laptops toward high-performance mixed-signal semiconductors, including technologies used in biometric passports.

• 2007

  SSMC establishes research and development centre[1]Systems on Silicon Manufacturingen.wikipedia.org

  Other

  SSMC established an R&D centre to develop specialized manufacturing processes and support automotive, near-field communication and radio-frequency applications.

• 2007

  SSMC establishes a research and development centre[1]Systems on Silicon Manufacturingen.wikipedia.org

  Other

  SSMC established an R&D centre focused on specialized manufacturing processes and application areas including automotive, near-field communication, and radio-frequency markets.

• 2006

  SSMC ownership structure changes following NXP and TSMC share purchases[1]Systems on Silicon Manufacturingen.wikipedia.org

  M&A · Other

  NXP Semiconductors and TSMC increased their stakes in SSMC by purchasing shares previously held by EDB Investments. The reported resulting ownership was 61.2% for NXP and 38.8% for TSMC.

• 2006

  SSMC increases ownership stakes held by Philips and TSMC[1]Systems on Silicon Manufacturingen.wikipedia.org

  M&A

  NXP Semiconductors, formerly associated with Philips’ semiconductor business, and TSMC increased their holdings in SSMC by acquiring shares previously held by EDB Investments. Their resulting ownership stakes were reported as 61.2% for NXP and 38.8% for TSMC.

1. 1Systems on Silicon Manufacturingen.wikipedia.org