Siliconware Precision Industries
Taiwan-based semiconductor assembly, packaging, and testing services provider.
Last updated August 22, 2026
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Overview
Siliconware Precision Industries Co., Ltd., commonly known as SPIL, is a Taiwan-based provider of outsourced semiconductor assembly and test services. Founded in 1984 and headquartered in Taichung, the company developed its business around the back-end stages of semiconductor manufacturing: packaging integrated circuits, testing packaged devices, and supporting the movement of finished semiconductor products through related logistics and handling processes. SPIL's packaging activities are intended to protect semiconductor dies, connect them to external systems, and help manage the electrical and thermal requirements of electronic products. Its packaging capabilities include substrate-based ball-grid-array packages and lead-frame packages. The company has also provided testing services for logic, mixed-signal, and embedded-memory devices. These tests are used to assess the performance and reliability of packaged semiconductor products before they are delivered into electronic systems. In addition to core packaging and testing, SPIL has offered turnkey services that combine multiple stages of semiconductor back-end production. Related services described for the company include wafer probing, shipment support, and tape-and-reel handling. This type of integrated offering allows semiconductor customers to outsource a broader portion of assembly, inspection, testing, and delivery preparation rather than managing every stage independently. The company initially operated as an independent publicly traded semiconductor services business. In 2000, it became publicly traded on NASDAQ and merged with Siliconware Corporation. SPIL subsequently expanded through investments, acquisitions, and corporate combinations, including the acquisition of common shares in ChipMOS Technologies in 2007 and the combination with Siliconware Investment Company in 2009. It also maintained a long-running patent dispute with Tessera Technologies that was settled in 2013. A major strategic turning point came in 2016, when SPIL and longtime competitor ASE Technology announced plans to combine. The transaction placed the businesses under a new holding-company structure associated with ASE Group. The combination was completed and the resulting holding company was listed on Taiwanese and United States exchanges in 2018. This changed SPIL's position from an independently listed competitor in the outsourced semiconductor assembly and test industry to a company operating within one of the world's major semiconductor services groups. SPIL serves markets connected with personal computers, communications equipment, and consumer electronics integrated circuits. Its competitive environment has included international outsourced assembly and test companies such as Amkor Technology and STATS ChipPAC. The company has also reported or maintained management-system and environmental, quality, occupational-safety, and hazardous-substance certifications, including ISO 9001, ISO 14001, ISO 14064-1, QS 9000, TS16949, OHSAS 18001, IECQ HSPM, and PAS 2050-related verification. Publicly available reference material does not provide enough current operating detail to characterize SPIL's present standalone financial scale, executive team, or exact facility footprint. Its corporate identity is nevertheless associated with semiconductor packaging, wafer probing, device testing, turnkey back-end manufacturing, and its integration into the ASE Group.
History
Siliconware Precision Industries was established in Taiwan in 1984 as a semiconductor back-end manufacturing company. Its business centered on the assembly, packaging, and testing of integrated circuits, activities that occur after semiconductor wafers have been fabricated. Packaging protects an exposed semiconductor die, provides electrical connections to a circuit board or other system, and can assist with thermal management. Testing verifies that packaged devices meet expected performance and reliability requirements. During its development, SPIL served semiconductor applications associated with personal computers, communications products, and consumer electronics. Its packaging portfolio included substrate-based ball-grid-array packages and lead-frame packages. Its testing operations covered logic, mixed-signal, and embedded-memory devices. The company also provided wafer probing, tape-and-reel handling, shipment support, and turnkey services combining several back-end manufacturing steps. In 2000, SPIL became a publicly traded company on NASDAQ and merged with Siliconware Corporation. The merger broadened the company's corporate structure and formed part of its expansion as an international outsourced semiconductor assembly and test provider. SPIL later pursued acquisitions and investments in related businesses. In 2007, it acquired common shares of ChipMOS Technologies Ltd. In 2008, reference material identifies an acquisition involving Taiwan Occupational Safety and Health Management. In 2009, SPIL merged with Siliconware Investment Company Ltd. The company also faced a significant intellectual-property dispute. SPIL and its United States subsidiary, Siliconware USA, were involved in long-running patent infringement litigation with Tessera Technologies. The dispute was settled in 2013. Under the settlement, Siliconware agreed to make a partial upfront payment followed by smaller quarterly payments during the subsequent five years, in return for release from the litigation. The available reference material does not specify the total settlement value and therefore no financial amount is recorded here. SPIL's competitive position was shaped by the growth of global outsourced semiconductor assembly and test. Companies identified as competitors in reference material include Amkor Technology and STATS ChipPAC. Quality, environmental management, occupational safety, hazardous-substance management, and carbon-accounting standards were among the systems and certifications associated with the company's operations. These included ISO 9001, ISO 14001, ISO 14064-1, QS 9000, TS16949, OHSAS 18001, IECQ HSPM, and PAS 2050-related verification. In 2016, SPIL and ASE Technology, described as a longtime competitor, announced a plan to combine. The transaction reflected broader consolidation in the semiconductor services sector and was organized through a new holding-company structure connected with ASE Group. The combination was completed in 2018, and the new holding company was listed on Taiwanese and United States exchanges. As a result, SPIL became part of the ASE Group structure rather than continuing solely as an independent competitor in the form described before the transaction. The available sources provide limited information about later product introductions, current executives, individual facilities, or current financial performance. Accordingly, this dossier describes SPIL's documented historical business scope and corporate transition without assigning unsupported current market-share, revenue, or management claims.
- 2018
Holding-company combination completed
[1]The combination involving SPIL and ASE Technology was completed, and the resulting holding company was listed on Taiwanese and United States exchanges.
- 2016
Combination agreement with ASE Technology
[1]SPIL and ASE Technology announced a plan to combine under a new holding-company structure.
- 2013
Tessera patent dispute settlement
[1]SPIL and Siliconware USA settled long-running patent infringement litigation with Tessera Technologies under a staged-payment arrangement.
- 2009
Siliconware Investment Company merger
[1]SPIL merged with Siliconware Investment Company Ltd.
- 2008
Acquisition involving occupational-safety business
[1]Reference material records an acquisition involving Taiwan Occupational Safety and Health Management.
- 2007
Investment in ChipMOS Technologies
[1]SPIL acquired common shares of ChipMOS Technologies Ltd.
- 2000
Public listing and Siliconware Corporation merger
[1]SPIL became publicly traded on NASDAQ and merged with Siliconware Corporation.
- 1984
Company founded
[1]Siliconware Precision Industries was established in Taiwan to provide semiconductor back-end manufacturing services.
Products and positioning
An established Taiwan-based outsourced semiconductor assembly and test provider serving personal-computer, communications, and consumer-electronics semiconductor markets, with operations associated with the ASE Group.
Semiconductor packaging
Substrate-based ball-grid-array packages
SPIL has provided substrate-based ball-grid-array packaging for integrated circuits. These packages connect semiconductor dies to external electronic systems while protecting the die and supporting the electrical and thermal requirements of the finished device.
Semiconductor packaging
Lead-frame packages
Lead-frame packages form another documented part of SPIL's packaging activities. They use a lead-frame structure to provide the external electrical interface and mechanical support for packaged semiconductor devices.
Semiconductor testing
Logic, mixed-signal, and embedded-memory testing
The company has tested packaged logic, mixed-signal, and embedded-memory devices. These services are intended to measure device performance and reliability and to identify products that do not meet customer specifications.
Semiconductor testing
Wafer probing
Wafer probing is among the related semiconductor services attributed to SPIL. It enables electrical examination of dies or devices at the wafer stage before subsequent packaging and final testing steps.
Outsourced semiconductor services
Turnkey assembly and test services
SPIL has offered turnkey services that combine packaging, testing, probing, handling, shipment, and other back-end activities. The model gives semiconductor customers an integrated outsourcing route for multiple production and delivery stages.
Controversies
2013
SPIL and Siliconware USA settle patent litigation with Tessera Technologies
Siliconware Precision Industries and Siliconware USA reached a settlement with Tessera Technologies in a long-running patent infringement dispute. The settlement included an upfront payment and additional quarterly payments over a five-year period in exchange for release from the litigation.
Brand decisions
2016
Announce combination with ASE TechnologyM&ABackground
SPIL and ASE Technology were longtime competitors in outsourced semiconductor assembly and testing. Their proposed combination responded to consolidation in the semiconductor services industry and was structured through a new holding company associated with ASE Group.
Action taken
The companies announced a combination plan in 2016, with the businesses to operate under a new holding-company structure.
Aftermath
The combination was completed in 2018, and the resulting holding company was listed on Taiwanese and United States exchanges.
2013
Settle Tessera patent litigationOtherBackground
SPIL and Siliconware USA had been involved in long-running patent infringement litigation with Tessera Technologies.
Action taken
The companies agreed to a settlement involving a partial upfront payment and smaller quarterly payments over the following five years in exchange for release from the litigation.
Aftermath
The settlement ended the referenced litigation. The available material does not disclose the total payment amount.
Recent events
- Unconfirmed
NVIDIA and supply chain partners announce manufacturing capacity expansion plans[3]
NVIDIA announced plans with supply chain partners to expand manufacturing capacity across substrates, advanced packaging, semiconductor testing and optical engines. The reported expansions include facilities and operations in the United States, Japan, South Korea, Taiwan and Singapore.
Sources3 sources
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