Silicon Box

Silicon Box Pte Ltd is an independent semiconductor company headquartered in Singapore and focused on advanced packaging, chiplet integration, and backend infrastructure for next-generation integrated circuits. Its activities sit in the back-end-of-line portion of semiconductor production, where individual dies or chiplets are interconnected and packaged into functional systems. The company operates in a space adjacent to outsourced semiconductor assembly and test providers, but its stated proposition extends beyond conventional packaging: it also provides design and integration guidance to customers moving from traditional monolithic designs toward chiplet-based architectures. The company was established in 2021 by Byung Joon Han, Sehat Sutardja, and Weili Dai. Their backgrounds span advanced packaging, semiconductor design, and business management. The founders had discussed the long-term limits and practical challenges associated with Moore's law since the 1980s. Their later work reinforced the view that continued computing improvements would require alternatives or complements to simply shrinking transistor geometries. Sutardja and Dai had previously commercialized a chiplet platform in 2015, but the founders identified a shortage of scalable backend infrastructure capable of supporting wider chiplet adoption. After leaving Marvell, they pursued the development of an ecosystem intended to make chiplet-based systems more manufacturable. Silicon Box presents chiplets as a way to combine separately manufactured dies in a single package. In principle, this can improve performance, reduce device size, increase design flexibility, and support reliability objectives. The company says its proprietary fabrication approach uses interconnections below five microns and is designed to minimize the distance between chiplets. It has also described its manufacturing approach as standardized large-format production for chiplet integration, an effort to bridge the gap between research demonstrations and repeatable commercial manufacturing. Silicon Box began building its industrial base in Singapore. Groundbreaking for its first manufacturing facility took place on July 22, 2022, and construction was completed in approximately eleven months. The facility opened in July 2023 in Tampines after a reported construction investment of US$2 billion. The site covers approximately 73,000 square meters and is intended to manufacture semiconductor chiplet interconnections. The company said the Singapore operation would add approximately 1,200 jobs locally. Its opening ceremony on July 20, 2023, included Singapore Economic Development Board chairman Png Cheong Boon, ecosystem partners, and investors. In January 2024, Silicon Box was reported to have raised US$200 million in a Series B financing round at a valuation above US$1 billion. Reported participants included BRV Capital, Lam Capital, TDK Ventures, and the three founders. The financing supported the company's expansion ambitions and helped establish it as one of the more prominent privately funded chiplet-packaging ventures. Silicon Box subsequently announced plans for a manufacturing facility in northern Italy. In March 2024, the company said the project would involve an investment of EUR 3.2 billion and would be supported by Italy's Ministry of Enterprises and Made in Italy. The proposed site was expected to create at least 1,600 direct jobs, in addition to employment associated with construction, logistics, and the wider supply chain. Overall, Silicon Box positions itself as an infrastructure and integration specialist for chiplet adoption, combining process technology, manufacturing capacity, and customer design support rather than competing solely as a conventional packaging subcontractor.

Silicon Box's origins lie in a long-running collaboration among Byung Joon Han, Sehat Sutardja, and Weili Dai. The three founders had considered the future of semiconductor development since the 1980s, including the possibility that conventional transistor scaling would eventually face economic and technical constraints. Their respective experience covered advanced packaging, chip design, and company management, giving the founding team expertise across the semiconductor value chain. A key step in the company's intellectual background came in 2015, when Sutardja commercialized a chiplet platform. Chiplets offered a means of assembling multiple separately manufactured dies into a larger system, but the founders encountered a practical limitation: the industry lacked enough backend manufacturing infrastructure to scale the approach. After Sutardja and Dai departed Marvell, they concentrated on developing the broader ecosystem needed to make chiplet architectures commercially viable. Han's packaging experience complemented Sutardja's design background and Dai's business expertise. The founders reunited in 2021 to establish Silicon Box. The company was formed as an independent advanced-packaging and integration business rather than as a traditional integrated device manufacturer. Its intended role was to provide the process technology, manufacturing capacity, and technical support required by customers adopting chiplet designs. Silicon Box has described its proprietary process as capable of producing interconnections below five microns and has emphasized short interconnection distances and standardized large-format manufacturing. The company moved rapidly from formation to industrial construction. Groundbreaking for its first manufacturing facility took place on July 22, 2022. Construction was completed in approximately eleven months, leading to a formal opening ceremony on July 20, 2023. The Singapore facility is located in Tampines, occupies about 73,000 square meters, and was reported to require US$2 billion to construct. Silicon Box said the facility would manufacture chiplet interconnections and employ approximately 1,200 additional people in Singapore. The opening involved Singapore's Economic Development Board, ecosystem partners, and investors, linking the project to the country's effort to strengthen its semiconductor manufacturing base. In January 2024, Silicon Box was reported to have completed a US$200 million Series B financing round at a valuation exceeding US$1 billion. The reported investors included BRV Capital, Lam Capital, TDK Ventures, and the founders. The financing indicated continued investor interest in chiplet infrastructure and provided support for the company's expansion plans. In March 2024, Silicon Box announced a proposed second major manufacturing project in northern Italy. The company stated that the project would involve EUR 3.2 billion of investment and would be supported by Italy's industry ministry. It expected the facility to generate at least 1,600 direct jobs, with further employment connected to construction, logistics, and suppliers. The Italian proposal reflected Silicon Box's ambition to develop a geographically broader manufacturing footprint. The company's business remains centered on the transition from conventional packaging to chiplet-based integration. Rather than presenting chiplets solely as a design concept, Silicon Box seeks to address the production bottleneck through dedicated backend infrastructure and customer consulting. Its development therefore reflects a wider semiconductor-industry shift toward advanced packaging as a source of system-level performance, integration density, and design flexibility.

• 2024

  Series B financing

  [1]Silicon Boxen.wikipedia.org

  Silicon Box raised a reported US$200 million Series B round at a valuation above US$1 billion.

• 2024

  Italian manufacturing project announced

  [1]Silicon Boxen.wikipedia.org

  The company announced plans for a EUR 3.2 billion manufacturing facility in northern Italy, with an expected minimum of 1,600 direct jobs.

• 2023

  Singapore manufacturing facility opens

  [1]Silicon Boxen.wikipedia.org

  The Tampines facility completed construction in approximately eleven months and held its grand opening on July 20.

• 2022

  Singapore facility breaks ground

  [1]Silicon Boxen.wikipedia.org

  Construction of Silicon Box's first manufacturing facility began in Singapore on July 22.

• 2021

  Silicon Box founded

  [1]Silicon Boxen.wikipedia.org

  Byung Joon Han, Sehat Sutardja, and Weili Dai established Silicon Box as an independent advanced-packaging and chiplet-integration company.

• 2015

  Chiplet platform commercialization

  [1]Silicon Boxen.wikipedia.org

  Sehat Sutardja commercialized a chiplet platform, helping establish the technical foundation for the founders' later focus on scalable chiplet manufacturing infrastructure.

An independent advanced-packaging and chiplet-integration specialist that combines manufacturing infrastructure with design consulting. Silicon Box is positioned between a conventional OSAT provider and a semiconductor technology partner, helping customers adopt chiplet architectures at commercial scale.

• Advanced semiconductor packaging · 2021

  Chiplet interconnection manufacturing

  Silicon Box manufactures backend interconnections intended to combine multiple chiplets into a single integrated package. Its stated process uses sub-five-micron fabrication and is designed to keep connections between chiplets short, supporting high-density integration and system-level performance.

• Chiplet integration platform · 2021

  Large-format chiplet integration

  The company promotes standardized large-format production as a way to move chiplet integration beyond individual prototypes and toward repeatable commercial manufacturing. The offering is intended for customers seeking to assemble separately produced semiconductor dies within advanced packages.

• Semiconductor design services · 2021

  Chiplet design and integration consulting

  Silicon Box provides design consulting and technical integration support for companies transitioning from traditional packaging schemes to chiplet-based systems. The service connects package-level manufacturing considerations with architectural and design decisions.

• 2024

  Raise Series B financingM&A

  Background

  Silicon Box sought capital to support the expansion of its advanced-packaging and chiplet-integration business.

  Action taken

  The company raised a reported US$200 million Series B round from BRV Capital, Lam Capital, TDK Ventures, and the founders.

  Aftermath

  The round reportedly placed the company's valuation above US$1 billion and strengthened its capacity to pursue international expansion.

  Series B financing. US$200 million (January 2024)

  Source

• 2024

  Plan northern Italy manufacturing expansionStrategy

  Background

  After establishing its first major facility in Singapore, Silicon Box pursued a broader international manufacturing footprint.

  Action taken

  The company announced a proposed manufacturing plant in northern Italy backed by Italy's Ministry of Enterprises and Made in Italy.

  Aftermath

  The project was expected to create at least 1,600 direct jobs, with additional employment linked to construction, logistics, and suppliers.

  Planned investment. EUR 3.2 billion (March 2024)

  Source

• 2023

  Build a dedicated Singapore chiplet-manufacturing baseStrategy

  Background

  The company identified insufficient backend infrastructure as a barrier to scaling chiplet adoption.

  Action taken

  Silicon Box constructed and opened a large manufacturing facility in Tampines focused on chiplet interconnections.

  Aftermath

  The facility established Silicon Box's initial production footprint and was associated with plans to add approximately 1,200 jobs in Singapore.

  Reported facility construction investment. US$2 billion (2023)

  Source

• 2024

  Silicon Box raises US$200 million in Series B financing[1]Silicon Boxen.wikipedia.org

  Other

  The company was reported to have raised US$200 million in a Series B round at a valuation above US$1 billion. Reported investors included BRV Capital, Lam Capital, TDK Ventures, and the founders.

• 2024

  Silicon Box announces planned manufacturing expansion in northern Italy[1]Silicon Boxen.wikipedia.org

  Other

  Silicon Box announced a proposed EUR 3.2 billion manufacturing project in northern Italy, backed by Italy's Ministry of Enterprises and Made in Italy. The project was expected to create at least 1,600 direct jobs.

• 2023

  Silicon Box opens advanced chiplet manufacturing facility in Singapore[1]Silicon Boxen.wikipedia.org

  Product launch · Other

  Silicon Box held the opening ceremony for its Tampines manufacturing facility in July 2023. The reported US$2 billion site covers approximately 73,000 square meters and is intended to produce semiconductor chiplet interconnections.

1. 1Silicon Boxen.wikipedia.org