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Qualcomm

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An American fabless semiconductor and wireless-technology company whose platforms and patent portfolio support mobile communications, computing, automotive systems, IoT, and on-device artificial intelligence.

Last updated October 25, 2026

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Overview

Qualcomm is an American multinational technology company headquartered in San Diego, California. Founded in 1985 by Irwin Jacobs and six other former Linkabit employees, it developed from a communications research and engineering business into one of the most influential companies in wireless technology. Its name is derived from “Quality Communications.” The company’s early growth was funded in part by Omnitracs, a satellite communications system for trucking fleets that Qualcomm developed after merging with Omninet in 1988. Revenue from that business helped finance research into code-division multiple access, or CDMA, a spread-spectrum method for sharing wireless spectrum. Qualcomm promoted CDMA as an alternative to time-division multiple access during the development of second-generation cellular networks. After extensive trials and industry debate, the technology was adopted in North America as the IS-95, or cdmaOne, standard and became an important foundation for later 3G systems. Qualcomm built a distinctive business model around two mutually reinforcing activities. Its semiconductor operations design modems, application processors, radio-frequency components, connectivity products, automotive systems, and embedded computing platforms, generally using a fabless manufacturing model. Its licensing business manages a large portfolio of cellular patents, including patents relevant to CDMA, WCDMA, LTE, and 5G standards. This combination has made Qualcomm both a major supplier of chips and a licensor to handset manufacturers and other communications companies. The Snapdragon brand became Qualcomm’s best-known consumer-facing platform. Snapdragon products combine CPUs, graphics processors, cellular modems, imaging, security, connectivity, and neural-processing capabilities for smartphones, tablets, PCs, wearables, gaming devices, and other connected products. The company has also expanded its scope beyond handsets. Its Snapdragon X platforms target Windows PCs; Snapdragon Digital Chassis addresses automotive connectivity, digital cockpits, driver assistance, and vehicle cloud services; and Dragonwing products target industrial and enterprise edge-computing applications. Acquisitions have supported this diversification. The acquisition of NUVIA strengthened Qualcomm’s custom CPU efforts and contributed to the Oryon CPU used in newer PC and mobile platforms. Arriver added driver-assistance and autonomous-driving software capabilities, while Autotalks expanded vehicle-to-everything technology. Qualcomm has also pursued capabilities in AI, industrial IoT, data-center connectivity, and low-power edge computing. The company has repeatedly faced legal and regulatory challenges concerning its licensing practices, royalty structures, and relationships with device manufacturers. Litigation involving the United States Federal Trade Commission, the European Union, South Korea, China, Taiwan, and other jurisdictions examined competition and patent-licensing issues. Qualcomm also engaged in extensive litigation with Apple until the two sides settled in 2019. Under Cristiano Amon, who became chief executive in 2021, Qualcomm has emphasized reducing dependence on smartphones by growing automotive, IoT, PC, industrial, and on-device AI businesses.

History

Qualcomm was established on July 1, 1985, by seven former Linkabit employees led by Irwin Jacobs. It initially operated as a contract research and development organization serving government, defense, and communications projects. In 1988 it merged with Omninet and obtained funding to develop Omnitracs, a satellite communications service for trucking companies. Omnitracs generated revenue and technical experience that allowed Qualcomm to finance ambitious research into digital cellular communications. During the late 1980s and early 1990s, Qualcomm developed a commercial form of CDMA. The approach initially faced opposition from companies invested in TDMA and skepticism about its ability to support large-scale mobile networks. Qualcomm addressed technical problems such as the near-far effect through power-control, soft-handoff, and variable-rate coding techniques. Demonstrations and field trials persuaded carriers and equipment companies to reconsider the technology. In 1993, the industry adopted Qualcomm’s CDMA approach as IS-95A, and commercial networks began operating in the mid-1990s. The company went public in 1991 and raised additional capital in 1995 to support the manufacture and deployment of CDMA phones, base stations, and related equipment. Qualcomm later reorganized in 1998, separating or exiting lower-margin equipment activities and concentrating on chipsets and patent licensing. This restructuring helped establish the business model that remains central to the company: designing communications semiconductors while licensing intellectual property to manufacturers. Qualcomm expanded internationally as CDMA-based systems spread and as its technologies were incorporated into WCDMA, EV-DO, LTE, and eventually 5G. Snapdragon became the company’s principal platform brand for smartphones and connected devices. Under Paul Jacobs, the company increased research into internet-connected devices and acquired Flarion Technologies, whose wireless broadband expertise contributed to the company’s development work. Steve Mollenkopf became chief executive in 2014 and promoted applications in cars, wearables, and other markets. The period from 2016 onward was marked by major strategic transactions and regulatory disputes. Qualcomm proposed acquiring NXP Semiconductors, but the transaction expired in 2018 after it failed to obtain the required approval in China amid broader trade tensions. Broadcom made an unsolicited bid for Qualcomm that was ultimately blocked by the United States government on national-security grounds. Qualcomm also faced competition investigations and litigation concerning its licensing practices, including proceedings involving the FTC and Apple. Cristiano Amon became chief executive in 2021. Qualcomm acquired NUVIA that year to strengthen custom CPU design, then acquired Arriver in 2022 for driver-assistance software and Cellwize for cellular-network automation capabilities. The company pursued automotive growth through Snapdragon Digital Chassis and sought to expand vehicle-to-everything capabilities through Autotalks. In computing, NUVIA’s technology evolved into Oryon-based Snapdragon X PC platforms and later mobile products. Qualcomm has continued to describe its longer-term strategy as diversification across automotive, IoT, industrial edge computing, PCs, and artificial intelligence while retaining mobile connectivity as its foundation.

  • 2024

    Snapdragon X PCs reach the market

    [11]

    Snapdragon X Elite and X Plus platforms appear in the initial generation of Copilot+ PCs.

  • 2024

    Snapdragon 8 Elite launches

    [12]

    Qualcomm launches a flagship mobile platform built around its Oryon CPU architecture and enhanced on-device AI capabilities.

  • 2023

    Snapdragon X Series is introduced

    [10]

    Qualcomm introduces an Oryon-based Windows PC platform with integrated CPU, GPU, connectivity, and neural-processing capabilities.

  • 2022

    Arriver is acquired

    [9]

    Qualcomm acquires Arriver’s driver-assistance and autonomous-driving software assets.

  • 2021

    Cristiano Amon becomes CEO

    [5]

    Amon succeeds Mollenkopf and makes diversification beyond handsets a central strategic priority.

  • 2021

    NUVIA is acquired

    [8]

    Qualcomm acquires NUVIA to build custom high-performance CPU technology for mobile, PC, and automotive products.

  • 2019

    Apple and Qualcomm settle litigation

    [4]

    The companies end worldwide litigation and sign new licensing and chipset supply arrangements.

  • 2014

    Steve Mollenkopf becomes CEO

    [7]

    Steve Mollenkopf succeeds Paul Jacobs as chief executive and emphasizes expansion into automotive and emerging connected-device markets.

  • 2007

    Snapdragon platform brand emerges

    [6]

    Qualcomm develops Snapdragon into a major platform brand for mobile processors and connected devices.

  • 1998

    Qualcomm restructures around chips and licensing

    [1]

    The company exits or separates lower-margin equipment activities and focuses more heavily on semiconductor design and intellectual-property licensing.

Products and positioning

A global wireless and computing technology platform built around cellular intellectual property, energy-efficient high-performance processors, connectivity, automotive electronics, and on-device AI.

  • Mobile processors and systems-on-chip · 2007

    Snapdragon Mobile Platforms

    Snapdragon mobile platforms combine application processors, cellular modems, graphics, imaging, security, connectivity, and AI acceleration. They are designed for smartphones and tablets across flagship, premium, midrange, and entry-level segments, and are supplied to numerous device manufacturers worldwide.

  • PC processors and platforms · 2023

    Snapdragon X Series

    The Snapdragon X family is Qualcomm’s Windows PC platform range. It uses the company’s Oryon CPU architecture alongside graphics, modem and connectivity functions, and a neural-processing unit intended for local AI workloads. The family targets thin laptops and other energy-efficient personal computers.

  • Flagship mobile platform · 2024

    Snapdragon 8 Elite

    Snapdragon 8 Elite is a flagship smartphone platform introduced in 2024. It uses an Oryon-based custom CPU and emphasizes high performance per watt, generative AI execution on the device, graphics, photography, video processing, and premium cellular connectivity.

  • Automotive technology · 2020

    Snapdragon Digital Chassis

    Snapdragon Digital Chassis is a portfolio for software-defined vehicles. Its components address digital cockpits, telematics, connected services, advanced driver assistance, vehicle connectivity, and cloud-linked automotive functions. Qualcomm positions the portfolio as a modular technology base for automakers and suppliers.

  • Patent licensing · 1985

    Qualcomm Technology Licensing

    Qualcomm Technology Licensing manages licenses for Qualcomm’s cellular and communications intellectual property. The portfolio includes patents relevant to multiple generations of wireless standards, including CDMA, WCDMA, LTE, and 5G. Licensing has historically been a major part of Qualcomm’s business model and a recurring subject of regulatory scrutiny.

  • Industrial and enterprise computing

    Dragonwing

    Dragonwing is a Qualcomm product family directed at industrial, enterprise, embedded, and edge-computing applications. It combines connectivity, processing, AI acceleration, and long-life embedded-system capabilities for uses such as robotics, industrial automation, retail systems, and connected infrastructure.

Controversies

  • 2022

    Arm–Qualcomm licensing dispute

    Arm argued that NUVIA-derived designs could not be transferred to Qualcomm without permission under the relevant licensing arrangements. Qualcomm maintained that its licenses covered its custom processor work. A 2024 jury proceeding produced a partial Qualcomm win and a mistrial on one issue.

    Source

  • 2021

    Red Rock sues Apple and Qualcomm over alleged patent infringement

    Red Rock sued Apple and Qualcomm in the U.S. District Court for the Western District of Texas, alleging that Qualcomm products used in Apple iPhone 12 models infringed its radio-frequency calibration patent. The allegations are not presented as a court determination.

    Source

  • 2021

    Sol IP sues Qualcomm over patents

    Sol IP filed a lawsuit accusing Qualcomm of infringing 28 patents relating broadly to wireless communications, including LTE, 5G, and Wi-Fi technologies. The allegations are not stated as a court determination.

    Source

  • 2021

    Which? sues Qualcomm over patent licensing fees

    UK consumer organization Which? filed a lawsuit against Qualcomm, alleging abuse of market dominance through its patent licensing and chip supply practices and seeking more than $600 million in compensation.

    Source

  • 2020

    EU investigates Qualcomm over alleged 5G radio-frequency chip antitrust conduct

    The European Commission was investigating whether Qualcomm used its market position in 5G modem chips in the radio-frequency chip market to engage in anticompetitive conduct. The investigation was ongoing; the source reports no determination that Qualcomm violated the rules.

    Source

  • 2020

    Court issues Markman Order in ParkerVision patent case

    The U.S. District Court for the Middle District of Florida issued a patent claim-construction ruling in the ongoing action between ParkerVision and Qualcomm and HTC. The court adopted ParkerVision's proposed construction for seven of ten disputed terms and a slightly modified version for the other three. The underlying infringement allegations remain allegations; the ruling addressed claim construction.

    Source

  • 2020

    Appeals court reverses FTC ruling against Qualcomm

    In a controversy involving Qualcomm, the United States Court of Appeals for the Ninth Circuit reversed a district court ruling that had gone against the company in a case brought by the Federal Trade Commission. The appellate court vacated the district court's judgment and permanent injunction against Qualcomm, concluding that Qualcomm's licensing policies were not anticompetitive. The decision removed the injunction that had been imposed on the company at the district court level and resolved the appeal in Qualcomm's favor.

    Source

  • 2019

    USITC launches investigation into patent infringement allegations

    The U.S. International Trade Commission decided to investigate allegations by GlobalFoundries that TSMC and other companies infringed 16 of its patents. The allegations are not presented as a determination of infringement.

    Source

  • 2019

    Monterey Research files patent suit against Qualcomm

    Monterey Research filed a patent infringement action against Qualcomm and related entities in Delaware District Court, involving eight Monterey patents. The infringement is alleged by Monterey; the source does not report a court determination.

    Source

  • 2017

    FTC antitrust litigation over licensing practices

    The United States Federal Trade Commission alleged that Qualcomm used licensing and supply practices, including its “no license, no chips” approach, to maintain or reinforce market power in modem chips and cellular patent licensing. A district court ruled against Qualcomm in 2019, but the Ninth Circuit reversed the judgment in 2020.

    Source

Read more(11)

Marketing campaigns

  • 2024Snapdragon Insiders

    Global

    A continuing community and creator program connects technology enthusiasts, gamers, and creators with Snapdragon product experiences, testing opportunities, events, and social content.

    Outcome. Created an ongoing product advocacy and community-marketing channel.

    Source
  • 2024Snapdragon and Manchester United partnership

    Global, with emphasis on sports and consumer electronics

    Qualcomm used the Snapdragon brand in a sponsorship and activation partnership with Manchester United, including shirt branding, digital content, supporter activities, and Snapdragon Insiders engagement.

    Outcome. Expanded Snapdragon’s visibility beyond specialist technology audiences into international sports and mass-market consumer culture.

    Source
  • 2023Power to Move

    Global digital and consumer markets

    A Snapdragon brand campaign presented mobile photography, audio, gaming, and creator experiences, using Snapdragon-powered devices in the production and storytelling.

    Outcome. Strengthened Snapdragon’s positioning as an experience-oriented consumer technology brand; no independently reported sales impact was identified.

    Source

Brand decisions

  • 2024

    Introduction of Snapdragon 8 EliteGeneration change

    Background

    Premium smartphone competition increasingly emphasized local generative AI, energy efficiency, imaging, and graphics in addition to conventional processing performance.

    Action taken

    Qualcomm introduced Snapdragon 8 Elite with an Oryon-based custom CPU and expanded on-device AI capabilities.

    Aftermath

    The platform became a foundation for subsequent flagship Android devices and reinforced Qualcomm’s emphasis on locally executed AI workloads.

    • MediaTek — MediaTek continued competing in the premium Android segment with its Dimensity flagship platforms.
    • Samsung — Samsung was among the manufacturers identified as adopting Snapdragon 8 Elite for flagship devices.
    Source

  • 2023

    Proposed acquisition of AutotalksM&A

    Background

    Vehicle-to-everything communication was becoming an important component of connected-car safety and intelligent transportation systems.

    Action taken

    Qualcomm announced an agreement to acquire Autotalks and planned to add its V2X safety technology to Snapdragon Digital Chassis.

    Aftermath

    The transaction was later completed in June 2025 for an undisclosed amount, strengthening Qualcomm’s V2X portfolio.

    Source

  • 2023

    Launch of Snapdragon X SeriesProduct launch

    Background

    Qualcomm aimed to extend its low-power mobile-computing expertise into Windows PCs and the emerging AI-PC category.

    Action taken

    The company introduced Snapdragon X platforms with custom Oryon CPUs, graphics, connectivity, and dedicated neural-processing hardware.

    Aftermath

    The platforms powered the first generation of Copilot+ PCs released in 2024 and established Qualcomm as a more visible competitor in Windows computing.

    • Microsoft — Microsoft selected Snapdragon X platforms for initial Copilot+ PC launches.
    • Intel — Intel continued competing in AI PCs with its Core Ultra family.
    Source

  • 2021

    Acquisition of NUVIAM&A

    Background

    Qualcomm sought stronger custom CPU capabilities as computing workloads expanded across PCs, mobile devices, vehicles, and edge systems.

    Action taken

    Qualcomm acquired NUVIA and integrated its CPU architects and technology into Qualcomm Technologies.

    Aftermath

    The technology contributed to the Oryon CPU architecture and later Snapdragon X and Snapdragon 8 Elite platforms.

    • Microsoft — Microsoft partnered with Qualcomm for initial Copilot+ PC products using Snapdragon X platforms.
    Source

  • 2019

    Global settlement with AppleOther

    Background

    The companies were engaged in worldwide litigation involving cellular patent royalties, chipset supply, and alleged contractual breaches.

    Action taken

    Qualcomm and Apple dismissed their global cases, entered a multiyear patent-license agreement, and signed a multiyear chipset supply agreement.

    Aftermath

    The settlement restored commercial cooperation and allowed Qualcomm to supply modem components for subsequent Apple products. The companies did not disclose the settlement payment in their joint announcement.

    Settlement payment. (Announced April 16, 2019; amount not disclosed)

    • Intel — Intel announced its withdrawal from the 5G smartphone modem business after the Apple–Qualcomm settlement and later sold related assets to Apple.
    Source

Recent events

  • Qualcomm announces planned job cuts[27]

    Reported:

    Qualcomm announced that it will begin notifying employees of job cuts in November as part of its annual reviews. CEO Cristiano Amon said the aim is to enhance the company's performance culture.

  • Qualcomm and Transsion renew global patent licenses[28]

    Reported:

    Qualcomm announced a long-term renewal of its global patent licenses with Transsion Holdings for 4G and 5G mobile devices through the end of 2031.

  • Unconfirmed

    OnePlus unveils OnePlus 16 in China with first 2nm Snapdragon chip[29]

    Reported:

    OnePlus has unveiled the OnePlus 16 in China, presented as the world's first consumer smartphone built on Qualcomm's 2-nanometer Snapdragon 8 Elite Extreme Gen 6. The base 12GB+256GB variant starts at CNY 5,999 (approximately $892 USD), a 50% increase over the OnePlus 15's CNY 3,999 entry price, with open sales in China beginning October 31, 2026. Following OnePlus's completed exit from North America and Europe in July 2026, the device is import-only for US, UK, Canadian, and European buyers, with no carrier agreements, official warranty, retail support, or software service infrastructure in those markets.

  • Sensorise launches Wega M1 next-generation GSM module for India's IoT ecosystem[30]

    Reported:

    Sensorise announced its next-generation GSM module Wega M1, designed and manufactured in India on the Qualcomm 216 LTE IoT Modem, on Thursday. The module was launched at India Mobile Congress 2026 by Union Minister for Communications Jyotiraditya Scindia and targets IoT/M2M applications such as smart meters, EVs, POS, asset tracking, logistics and industrial IoT, with go-to-market planned for Q1 2027.

    Weekdays and relative dates follow the original report; their exact calendar dates have not been verified.

  • First Android-based Googlebook laptops go on sale[31]

    Reported:

    Five Android-based Googlebook laptops went on sale, with models from Acer, Asus, and Lenovo running x86 Intel chips and models from Dell and HP running Qualcomm's Arm-based Snapdragon processors.

  • Unconfirmed

    Huawei agrees to a multi-year patent licensing deal with Qualcomm[32]

    Reported:

    Reuters reported that Huawei has agreed to a multi-year patent licensing deal with Qualcomm.

  • Unconfirmed

    Microsoft discontinues the 'Copilot Plus PC' brand name[33]

    Reported:

    Per a Windows Central report, Microsoft is no longer calling its new 12-inch Surface Pro and 13-inch Surface Laptop 'Copilot Plus PCs' even though they technically meet the brand's system requirements. Microsoft Surface CVP Brett Ostrom said 'These are not called Copilot Plus PCs,' and Qualcomm SVP of compute and gaming Kedar Kondap indicated computers offering the same experiences will 'probably' not use that branding anymore.

  • Unconfirmed

    Qualcomm unveils Snapdragon Sound Elite Gen 2 chip with integrated micro-power Wi-Fi 6E[34]

    Reported:

    Qualcomm introduced Snapdragon Sound Elite Gen 2, its first audio chip to integrate micro-power Wi-Fi 6E directly into the chip, enabling wireless earbuds and audio glasses to connect directly to home Wi-Fi networks and the cloud for lossless audio streaming. Qualcomm says the Elite is 30 percent smaller, consumes up to 40 percent less power, and has twice the AI processing capabilities of the previous generation chip, and that it is working with HP on an unnamed product, working closely with Bose, and pioneering a new category of intelligent hearables with Cleer.

  • Unconfirmed

    Qualcomm and Apple extend licensing agreement for chips[35]

    Reported:

    Reuters reports that Qualcomm and Apple have extended their licensing agreement covering chips. The source text does not specify terms, duration, or the exact date of the extension.

  • Unconfirmed

    Qualcomm unveils next-generation 5GHz Oryon CPU[36]

    Reported:

    Qualcomm announced its next-generation Oryon CPU, described as the first mobile processor designed to reach clock speeds of 5GHz, featuring a custom microarchitecture, higher IPC, and a tiered cache architecture including Oryon FlexCache. The CPU is aimed at upcoming flagship smartphones and is expected to debut in the Snapdragon 8 Elite Gen 6 flagship SoC at Snapdragon Summit 2026 on September 22nd.

Showing the 10 most recent.

Sources527 sources

  1. 1Qualcommen.wikipedia.org
  2. 2Qualcomm company informationqualcomm.com
  3. 3FTC v. Qualcomm case materialsftc.gov
  4. 4Apple and Qualcomm agree to drop all litigationapple.com
  5. 5Qualcomm investor governance informationinvestor.qualcomm.com
  6. 6Snapdragon platform brand emergesqualcomm.com
  7. 7Steve Mollenkopf becomes CEOqualcomm.com
  8. 8NUVIA is acquiredqualcomm.com
  9. 9Arriver is acquiredqualcomm.com
  10. 10Snapdragon X Series is introducedqualcomm.com
  11. 11Snapdragon X PCs reach the marketqualcomm.com
  12. 12Snapdragon 8 Elite launchesqualcomm.com
  13. 13Power to Movequalcomm.com
  14. 14Snapdragon Insidersqualcomm.com
  15. 15Snapdragon and Manchester United partnershipqualcomm.com
  16. 16Proposed acquisition of Autotalksqualcomm.com
  17. 17Arm–Qualcomm licensing disputereuters.com
  18. 18USITC launches investigation into patent infringement allegationseyeontaiwan.com
  19. 19Monterey Research files patent suit against Qualcommfinanznachrichten.de
  20. 20EU investigates Qualcomm over alleged 5G radio-frequency chip antitrust conductengadget.com
  21. 21Court issues Markman Order in ParkerVision patent casefinanznachrichten.de
  22. 22Appeals court reverses FTC ruling against Qualcommcnet.com
  23. 23Appeals court reverses FTC ruling against Qualcommandroidheadlines.com
  24. 24Red Rock sues Apple and Qualcomm over alleged patent infringementfinance.sina.com.cn
  25. 25Sol IP sues Qualcomm over patentslegal500.com
  26. 26Which? sues Qualcomm over patent licensing feesfinance.sina.com.cn
  27. 27高通宣布计划裁员economictimes.indiatimes.com
  28. 28高通与传音续签全球专利许可thefastmode.com
  29. 29一加在中国发布一加16，全球首发2纳米骁龙芯片techtimes.com
  30. 30Sensorise发布面向印度物联网生态的新一代GSM模块Wega M1aninews.in
  31. 31首批基于Android的Googlebook笔记本电脑上市开售theverge.com
  32. 32华为与高通达成多年期专利授权协议news.google.com
  33. 33微软停用“Copilot Plus PC”品牌名称theverge.com
  34. 34高通推出集成微功耗Wi-Fi 6E的Snapdragon Sound Elite Gen 2芯片theverge.com
  35. 35高通与苹果延长芯片许可协议news.google.com
  36. 36高通发布下一代5GHz Oryon CPUfonearena.com
  37. 37研华发布基于高通Dragonwing IQ-9075的边缘AI解决方案prnewswire.com
  38. 38高通任命瓦西姆·舒尔巴吉为欧洲、中东和非洲区总裁evertiq.com
  39. 39高通完成对Modular的收购finance.sina.com.cn
  40. 40Lumilens获9亿美元融资并正式推出siliconangle.com
  41. 41高通发布面向主流笔记本电脑的骁龙X2 Plus芯片pcmag.com
  42. 42高通在CES发布骁龙X2 Plus笔记本处理器engadget.com
  43. 43高通发布乐观销售展望foxbusiness.com
  44. 44高通与微软宣布加强AR合作finance.sina.com.cn
  45. 45高通与微软合作开发用于AR眼镜的定制芯片businesstoday.in
  46. 46高通与雷蛇推出骁龙手持游戏开发套件businesstoday.in
  47. 47小米12系列将全球首发骁龙8移动平台finance.sina.com.cn
  48. 48高通与谷歌合作优化人工智能模型pocketnow.com
  49. 49高通推出骁龙 8 Gen 1htxt.co.za
  50. 50Qualcomm与Razer合作开发掌上游戏开发套件techcrunch.com
  51. 51高通宣布下一代PC芯片计划finance.sina.com.cn
  52. 52高通宣布下一代 Arm 处理器计划finance.sina.com.cn
  53. 53高通与 Wikitude 合作推进 Snapdragon Spacestelecom.economictimes.indiatimes.com
  54. 54eInfochips 推出相机参考设计套件prnewswire.com
  55. 55Nothing与高通达成合作finance.sina.com.cn
  56. 56高通宣布收购 Veoneerbnext.com.tw
  57. 57Qualcomm与SSW Partners宣布收购Veoneertechcrunch.com
  58. 58高通发布 aptX Lossless 音频编解码器itbear.com.cn
  59. 59法院驳回高通专利相关诉讼请求finance.jrj.com.cn
  60. 60Intelbras与Qualcomm合作在巴西生产5G设备developingtelecoms.com
  61. 61华硕推出更新版ROG Phone 5S系列engadget.com
  62. 62高通提出收购Veoneerfinance.sina.com.cn
  63. 63英特尔称高通将使用其未来制程节点dailymaverick.co.za
  64. 64Intel与Qualcomm合作开发芯片techtimes.com
  65. 65中国电信颁发CTTTC终端技术认证finance.sina.com.cn
  66. 66高通推出Snapdragon Insiders手机finance.sina.com.cn
  67. 67Qualcomm宣布推出Snapdragon Insiders智能手机gsmarena.com
  68. 68Qualcomm与Asus推出售价1499美元的智能手机telecom.economictimes.indiatimes.com
  69. 69高通与 ASUS 合作推出智能手机androidcentral.com
  70. 70高通推出FSM200小基站5G RAN平台rfidworld.com.cn
  71. 71高通宣布合作推动5G毫米波全球推广finance.sina.com.cn
  72. 72高通推出多款5G新品finance.sina.com.cn
  73. 73高通将5G DU X100加速卡加入产品组合business-standard.com
  74. 74Qualcomm推出Snapdragon 888 Plus及两款5G模块siliconangle.com
  75. 75高通推出多款5G新品chinaz.com
  76. 76FOSSIL在中国发布Gen 5 LTE智能腕表prnasia.com
  77. 77高通推出七款物联网芯片sandiegouniontribune.com
  78. 78美格智能发布SRM930 5G模组rfidworld.com.cn
  79. 79Qualcomm推出七款物联网解决方案itwire.com
  80. 80三星发布 Galaxy Book Go 笔记本电脑betanews.com
  81. 81高通展示 Windows on ARM 开发套件extremetech.com
  82. 82高通宣布推出骁龙开发套件chinaz.com
  83. 83Qualcomm宣布推出基于Snapdragon的Windows 10开发者套件pocket-lint.com
  84. 84荣耀宣布荣耀50系列发布计划chinaz.com
  85. 85Lofelt与高通宣布VTX合作finance.sina.com.cn
  86. 86高通与苏州高铁新城宣布汽车科技合作finance.people.com.cn
  87. 87Oppo、Vodafone、Qualcomm与Ericsson合作推进德国首个商用5G SA网络gsmarena.com
  88. 88高通推出 Snapdragon Sound 音频技术finance.sina.com.cn
  89. 89高通发布Snapdragon Sound音频技术finance.sina.com.cn
  90. 90Airtel与高通合作推进5G网络部署medianama.com
  91. 91Qualcomm、ZTE与中国移动合作开展5G定位测试scmp.com
  92. 92高通推出第四代骁龙汽车数字座舱平台chinaz.com
  93. 93Veoneer与高通达成驾驶辅助技术开发合作协议citnews.com.cn
  94. 94高通宣布扩展Snapdragon Ride平台finance.sina.com.cn
  95. 95Seeing Machines 与 Qualcomm 同意设计驾驶员监控系统themarketreporter.co.uk
  96. 96高通发布两款汽车计算平台finance.sina.com.cn
  97. 97荣耀与芯片供应商签署合作协议businesstoday.in
  98. 98高通推出骁龙870 5G移动平台finance.sina.com.cn
  99. 99高通推出骁龙870 5Gtechpp.com
  100. 100高通宣布收购NUVIA的协议finance.sina.com.cn
  101. 101高通宣布收购NUVIAfinance.sina.com.cn
  102. 102“重新定义汽车”发布会 高通汽车发布第4代骁龙汽车数字座舱平台auto.sina.com.cn
  103. 103[图]高通发布骁龙460/662/720G：目标4G市场 支持WiFi 6和蓝牙5.1tech.sina.com.cn
  104. 104[图]高通骁龙768G发布：性能提升15% Redmi K30 Pro极速版首发tech.sina.com.cn
  105. 105【CES2020】搶車載技術商機！高通推出Snapdragon Ride平台，強化GM合作拚2023年量產bnext.com.tw
  106. 1062021年Q1发布：新一代OPPO Find X系列将搭载高通骁龙888 5G移动平台finance.sina.com.cn
  107. 1074G isn't dead yet: Qualcomm unveils LTE-versions of its midrange Snapdragon chips - CNETcnet.com
  108. 1085G＋XR燃点将至：高通推出全球首个“混搭”芯片平台finance.sina.com.cn
  109. 109布局5G未来：高通发布多款5G芯片finance.sina.com.cn
  110. 110诚迈科技携手高通亮相CES 2020推出全新EX4.0产品nbd.com.cn
  111. 111斥资300亿！高通收购自动驾驶公司Veoneerfinance.sina.com.cn
  112. 112除了骁龙 X60 5G 基带芯片，高通最新推出射频前端 ultraSAW 滤波器技术tech.sina.com.cn
  113. 113存储涨价导致手机销量下跌：高通都撑不住欲11月全球大裁员finance.sina.com.cn
  114. 114高通 Quick Charge 5 快充规范发布：15 分钟可充满 4500mAh 电池tech.sina.com.cn
  115. 115高通：明年将为智能手表推出全新的骁龙处理器digi.hsw.cn
  116. 116高通（QCOM.US）发布全新自动驾驶平台 2023年量产finance.sina.com.cn
  117. 117高通(QCOM.US)推出四款Wi-Fi 6E全新平台 数据峰值速度可达10.8Gbpsfinance.sina.com.cn
  118. 118高通(QCOM.US)推出四款Wi-Fi 6E全新平台 数据峰值速度可达10.8Gbps_个股资讯_市场_中金在线sc.stock.cnfol.com
  119. 119高通31亿美元收购射频前端企业，将射频技术集成到5G解决方案rfidworld.com.cn
  120. 120高通5G基带覆盖范围扩大 与合作伙伴共同加速5G部署_行业综合_行业_中金在线hy.stock.cnfol.com
  121. 121高通5G全家桶发布！XR2 5G头显今年落地，可无线体验桌面级视效finance.sina.com.cn
  122. 122高通5G全家桶深夜发布，XR2 5G头显今年落地，可无线体验桌面级视效finance.sina.com.cn
  123. 123高通6系首款5G Soc！骁龙690发布：8nm制程 GPU提升60％finance.sina.com.cn
  124. 124高通安蒙：已有超130款终端采用骁龙888 推出全新骁龙888 Plusfinance.sina.com.cn
  125. 125高通斥資14億美元，收購CPU新創Nuvia！迎戰蘋果與英特爾bnext.com.tw
  126. 126高通斥資14億美元收購晶片新創Nuvia！計畫投入手機、筆電市場 | 科技 | Newtalk新聞newtalk.tw
  127. 127高通发布2020财年第一财季财报 营收达50.77亿美元finance.sina.com.cn
  128. 128高通发布2021财年Q1财报：营收82亿美元 净利润大涨165%finance.sina.com.cn
  129. 129高通发布4nm工艺芯片 小米手机抢“全球首发”finance.sina.com.cn
  130. 130高通发布5G SoC骁龙765系列tech.sina.com.cn
  131. 131高通发布超级快充技术Quick Charge 5 可实现100W充电功率finance.sina.com.cn
  132. 132高通发布第二代3D声波传感器 解锁速度可提升50%finance.sina.com.cn
  133. 133高通发布第二代超声波屏下指纹识别器 可使手机解锁速度快50%finance.sina.com.cn
  134. 134高通发布第二代扩展现实平台，智能眼镜设备会迎来爆发吗？ifanr.com
  135. 135高通发布第二代骁龙8cx 5G笔记本平台：性能、续航超竞品50％tech.sina.com.cn
  136. 136高通发布第三代5G基带骁龙X60：首发5nm、全面聚合tech.sina.com.cn
  137. 137高通发布第三代5G基带骁龙X60：首发5nm、全面聚合tech.sina.com.cn
  138. 138高通发布第三代5G基带骁龙X60：首发5nm、全面聚合tech.sina.com.cn
  139. 139高通发布第一款支持5G的XR芯片骁龙XR2tech.sina.com.cn
  140. 140高通发布多款芯片加速扩张5G版图tech.sina.com.cn
  141. 141高通发布了针对智能手表的Wear 4100＋平台，性能功耗都有大幅提升tech.sina.com.cn
  142. 142高通发布两款 5G手机芯片finance.sina.com.cn
  143. 143高通发布两款 PC 专用芯片：骁龙 7c和骁龙 8ctech.sina.com.cn
  144. 144高通发布两款蓝牙音频SOC 小型化、降噪耳机一网打尽tech.sina.com.cn
  145. 145高通发布两款全新 TWS 耳机芯片：支持主动降噪和语音助手chinaz.com
  146. 146高通发布两款全新耳机芯片：支持主动降噪和语音助手tech.sina.com.cn
  147. 147高通发布两款真5G芯片，OPPO：我来首发高通5G手机finance.sina.com.cn
  148. 148高通发布强劲的Q4财报 为5G商业化做准备finance.sina.com.cn
  149. 149高通发布全球首个5nm5G基带X60 支持5G毫米波和6GHz以下聚合chinaz.com
  150. 150高通发布全球首个支持5G和AI的机器人平台finance.sina.com.cn
  151. 151高通发布全球首款5G XR平台 XR行业正式进入5G时代tech.sina.com.cn
  152. 152高通发布全新骁龙480平台，5G性能“准顶配”finance.sina.com.cn
  153. 153高通发布全新骁龙888移动平台赋能旗舰终端 小米11将首发finance.sina.com.cn
  154. 154高通发布全新骁龙移动平台 助推5G手机换机潮（附股）_市场掘金_市场_中金在线sc.stock.cnfol.com
  155. 155高通发布全新XR2参考设计，全面升级6DoF头手追踪、眼动追踪finance.sina.com.cn
  156. 156高通发布首个 5G+AI 无人机平台：基于物联网技术打造chinaz.com
  157. 157高通发布首款骁龙6系5G移动平台 推动全球5G体验普及finance.sina.com.cn
  158. 158高通发布首款支持5G网络的6系列骁龙690移动芯片组tech.sina.com.cn
  159. 159高通发布万元手机：只向社区粉丝出售，意欲为何finance.sina.com.cn
  160. 160高通发布骁龙 778G Plus、695、480 Plus 和 680 4G 四款芯片chinaz.com
  161. 161高通发布骁龙 7c/8c 芯片，这次的目标是中低端 PC 市场tech.sina.com.cn
  162. 162高通发布骁龙 888 芯片：5nm 工艺，集成 X60 5G 芯片chinaz.com
  163. 163高通发布骁龙 Wear 4100 系列芯片：12nm 工艺，处理器性能提升 85%tech.sina.com.cn
  164. 164高通发布骁龙 X60 基带：5nm 工艺设计，2021 年上市ifanr.com
  165. 165高通发布骁龙690：集成5G，CPU提升20%，AI性能提升超过70%tech.sina.com.cn
  166. 166高通发布骁龙690：CPU速度提升20% 支持5G和Wi-Fi 6tech.sina.com.cn
  167. 167高通发布骁龙690：CPU速度提升20%，支持5G、Wi-Fi6tech.sina.com.cn
  168. 168高通发布骁龙690移动平台 5G手机市场价格再下探tech.sina.com.cn
  169. 169高通发布骁龙732G处理器 4G芯片或由小米POCO首发finance.sina.com.cn
  170. 170高通发布骁龙765/765G，首款集成式5G移动平台tech.sina.com.cn
  171. 171高通发布骁龙865 Plus处理器：提升游戏性能 华硕联想手机将搭载tech.sina.com.cn
  172. 172高通发布骁龙865和骁龙 765/765G两款5G移动平台tech.sina.com.cn
  173. 173高通发布骁龙865及5G SoC骁龙765系列推动5G在2020年成为主流tech.sina.com.cn
  174. 174高通发布骁龙865Plus芯片，能效提升10%tech.sina.com.cn
  175. 175高通发布骁龙870 5G：去年旗舰芯片加强版，7nm制程工艺chinaz.com
  176. 176高通发布骁龙870 5G芯片 - 一颗加强版的865++finance.sina.com.cn
  177. 177高通发布骁龙870 5G移动平台 基于骁龙865 Plus打造finance.sina.com.cn
  178. 178高通发布骁龙888处理器，小米11将全球首发_原创_新浪众测zhongce.sina.com.cn
  179. 179高通发布骁龙888移动平台 支持全球毫米波和Sub-6GHz主要频段finance.sina.com.cn
  180. 180高通发布骁龙8cx Gen 3芯片：CPU性能提升85% GPU提升60%tech.ifeng.com
  181. 181高通发布骁龙自动驾驶计算系统 相关汽车2023年上路finance.sina.com.cn
  182. 182高通发布骁龙G3x Gen 1游戏平台：Switch掌机有对手了finance.sina.com.cn
  183. 183高通发布骁龙Wear 4100和4100+ 智能手表芯片组平台tech.sina.com.cn
  184. 184高通发布骁龙X60：全球首款5nm基带 2021年初上市finance.sina.com.cn
  185. 185高通发布骁龙X60调制解调器与QTM535天线模组tech.sina.com.cn
  186. 186高通发布骁龙X65 5G调制解调器：全球首款支持10Gbps 5G速率finance.sina.com.cn

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