National Center for Advanced Packaging (NCAP China)
NCAP China is a Wuxi-registered joint venture and national center for advanced packaging, testing and system integration for the IC industry.
Last updated September 16, 2026
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Overview
The National Center for Advanced Packaging (NCAP China) was registered in Wuxi, China in 2012 as a joint venture established by several investors, including leaders of the IC packaging and testing industry in China and the Institute of Microelectronics of Chinese Academy of Sciences. As a national center for advanced packaging, testing and system integration, NCAP works with system OEMs and supply chain partners on research and development to offer total solutions for the IC industry. Its stated research directions include 2.5D/3D technology (including TSV), high density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.
History
The National Center for Advanced Packaging (NCAP China) was registered in Wuxi, China in 2012 as a joint venture established by several investors, including the leaders of the IC packaging and testing industry in China and the Institute of Microelectronics of Chinese Academy of Sciences. As a national center for advanced packaging, testing and system integration, NCAP collaborates with system OEMs and supply chain partners and aggressively pursues research and development in order to offer total solutions for the IC industry. Its current research directions include 2.5D/3D technology (including TSV), high density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging. In recent years, NCAP has undertaken 16 science and technology projects and served for hundreds of companies. Up to the end of 2018, 724 patents had been applied for, including 658 invention patents and 28 international patents, and 282 invention patents and 12 international patents had been issued.
Products and positioning
A national center for advanced packaging, testing and system integration pursuing R&D to offer total solutions for the IC industry.
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