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Luxtelligence

Swiss EPFL spin-off commercializing thin-film lithium niobate and lithium tantalate photonic integrated circuits for the quantum and AI era.

Last updated September 29, 2026

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Overview

Luxtelligence is a Swiss photonics company founded in 2022 in Lausanne as a spin-off from EPFL. It develops and manufactures photonic integrated circuits (PICs) based on thin-film lithium niobate (TFLN) and thin-film lithium tantalate (TFLT) — advanced electro-optic materials that allow light to be manipulated on a chip with high speed and low energy consumption. The company positions itself as building "the next generation connectivity solutions for the Quantum and AI era," targeting the bandwidth and energy bottlenecks that increasingly constrain data centers, telecommunications, and emerging quantum and AI computing systems. Luxtelligence's product line is organized around a proprietary platform it calls LN-CORE, described as "the agile engine for high-performance R&D," and LT-PRO, described as "the volume-ready industrial engine for volume scale." The company also offers packaged electro-optic modulators as customizable units. Its technology rests on a Diamond-Like Carbon (DLC) etching process and on TFLN/TFLT integrated photonics research conducted at EPFL since 2017, which the founding team helped develop. In 2024 the company released lnoi400, which it describes as the world's first open-access process design kit (PDK) for thin-film lithium niobate, enabling external designers to build on the LN-CORE platform without deep material-physics expertise. The company operates a dedicated test facility in Switzerland with automated wafer-level probing, capable of characterizing wafers up to 200 mm and delivering verified Known-Good Dies (KGDs). It has demonstrated high-speed data transmission at the Optical Fiber Communication (OFC) conference in San Francisco in 2025 in collaboration with Keysight and Anritsu, and in 2025 it shipped its first commercial chips based on the LT-PRO platform. Luxtelligence is a private company (Luxtelligence SA) headquartered in Lausanne, Switzerland, and serves customers in photonics, semiconductor, telecom, and quantum technology markets.

History

Luxtelligence was founded in 2022 in Lausanne, Switzerland, as a spin-off from EPFL (École Polytechnique Fédérale de Lausanne). The core team brought together researchers and engineers who had developed thin-film lithium niobate (TFLN) and thin-film lithium tantalate (TFLT) integrated photonics at EPFL since 2017. The company's technology traces back to 2018, when the TFLX platform was born from a collaboration between Prof. Tobias J. Kippenberg's LPQM group at EPFL and Prof. Christian Koos' IPQ group at KIT (Karlsruhe Institute of Technology). This partnership combined world-class microfabrication with high-speed optical communications expertise to lay the groundwork for the technology. In the fourth quarter of 2022, Luxtelligence SA was incorporated, spinning off from EPFL to industrialize its proprietary Diamond-Like Carbon (DLC) etching technology and transition from academic research to a commercial entity dedicated to solving the bandwidth bottleneck. The company's technology originated in 2017 from PhD research and a doctoral thesis on integrating optoelectronic functions directly on silicon, proving the core principles of "optoelectronics on a chip." In the third quarter of 2023, Luxtelligence shipped its first wafer. In the first quarter of 2024, the company released lnoi400, which it describes as the world's first open-access process design kit (PDK) for thin-film lithium niobate. Partnering with leading EDA vendors, this PDK enabled designers to build on the LN-CORE platform without needing deep knowledge of the underlying material physics. In the second quarter of 2024, Luxtelligence inaugurated its LXT Test Facility in Switzerland, a dedicated testing lab featuring automated wafer-level probing that allows characterization of wafers up to 200 mm and delivery of verified Known-Good Dies (KGDs). In the first quarter of 2025, in collaboration with Keysight and Anritsu, Luxtelligence demonstrated high-speed data transmission at the Optical Fiber Communication (OFC) conference in San Francisco, proving the real-world readiness of its modulators for next-generation transceiver architectures. In the third quarter of 2025, the company shipped its first commercial chips based on its LT-PRO platform, marking a step toward volume-scale production of thin-film lithium tantalate photonic integrated circuits. Luxtelligence is headquartered in Lausanne, Switzerland, and operates in the photonics, semiconductor, telecommunications, and quantum technology markets. Its product line is organized around the LN-CORE platform (described as the agile engine for high-performance R&D), the LT-PRO platform (described as the volume-ready industrial engine for volume scale), and packaged electro-optic modulators. The company positions itself as building next-generation connectivity solutions for the quantum and AI era, harnessing advanced materials and pushing the boundaries of innovation, with photonic integrated circuits that deliver superior performance with lower energy consumption.

  • Research origins: PhD research and a doctoral thesis on integrating optoelectronic functions directly on silicon prove the core principles of "optoelectronics on a chip."

  • The TFLX platform is born from a collaboration between Prof. Tobias J. Kippenberg's LPQM (EPFL) and Prof. Christian Koos' IPQ (KIT), combining microfabrication with high-speed optical communications expertise.

  • Incorporation of Luxtelligence SA as an EPFL spin-off to industrialize proprietary Diamond-Like Carbon (DLC) etching technology.

  • First wafer shipped.

  • Launch of lnoi400, described as the world's first open-access PDK for thin-film lithium niobate, in partnership with leading EDA vendors.

  • Inauguration of the LXT Test Facility in Switzerland, featuring automated wafer-level probing for wafers up to 200 mm and verified Known-Good Dies (KGDs).

  • Live demo at OFC San Francisco with Keysight and Anritsu, demonstrating high-speed data transmission and real-world readiness of modulators for next-gen transceiver architectures.

  • First commercial chips based on the LT-PRO platform shipped.

Products and positioning

Developer of advanced-material photonic integrated circuits (TFLN/TFLT) positioned as next-generation connectivity solutions for the quantum and AI era, emphasizing superior performance with lower energy consumption.

  • LN-CORE

    The agile engine for high-performance R&D; a thin-film lithium niobate photonic integrated circuit platform.

  • LT-PRO

    The volume-ready industrial engine for volume scale; a thin-film lithium tantalate photonic integrated circuit platform.

  • Packaged Modulators

    The customizable packaged electro-optic unit.

  • lnoi400

    Open-access process design kit (PDK) for thin-film lithium niobate, described as the world's first, enabling designers to build on LN-CORE without deep material-physics knowledge.

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