Lorentz Solution

Lorentz Solution, Inc. is an American electronic design automation (EDA) company focused on electromagnetic (EM) simulation, design and sign-off for high-frequency semiconductor products. Based in Santa Clara, California, the company was founded in 2003 and received major institutional venture capital in 2004 from Telos Venture Partners — the investment group of Cadence Design Systems — and the WK Technology Fund. It describes itself as the first organization to envision and develop an EM design and verification platform with an integrated EM solver inside the IC design environment. The company's flagship offering is PeakView®, a 3D fullwave EM design and sign-off platform. Lorentz Solution positions PeakView® as delivering 3D EM accuracy across an ultra-wide frequency range from DC to mmWave and TeraHz frequencies, with flexible volume meshing, high EM isolation (a noise floor down to -130 dB) and high-capacity layout handling. The platform is aimed at analog circuits, photonic designs and IC-packaging layouts, and is used for EM simulation, design and sign-off/verification. It supports both direct solvers for maximum accuracy and iterative solvers for large-scale simulations, and includes foundry process-technology parsers (iRCX and ITF) so that models align with advanced process nodes from mainstream foundries. PeakView® is built to integrate with mainstream EDA flows rather than replace them. Lorentz Solution states that its platform blends with tools such as Virtuoso®, Custom Compiler™, Spectre/HSPICE simulators, and Calibre®/Synopsys™/Cadence® layout parasitic extractors (LPE), and that it was the first company to make EM extraction part of the LPE flow for verification through its HFD™ and PLX™ products. The product family also includes EMD™ for parametric EM synthesis and optimization of on-chip passives (T-coils, inductors, multi-layer spirals, transformers, mmWave couplers, co-planar waveguides, photonics transmission lines and similar topologies), LEM™ for 3D fullwave EM extraction and simulation, and tools such as EM Prototyping™, xLEM™ and Combo Cell™ that address EM coupling analysis before tapeout. Device and interconnect models can be exported as S-parameter or RLCK SPICE sub-circuits for circuit simulation. Lorentz Solution sells to wireless development companies, integrated device manufacturers (IDMs) and foundries worldwide, and says its technology is heavily used by top wireless developers. Its stated strategic focus is to maintain a leading position in EM design and sign-off for chiplet and 3DIC technologies for mmWave/TeraHz and AI applications. The company remains privately held and venture-backed, with no public listing.

Lorentz Solution, Inc. was founded in 2003 as an electromagnetic (EM) design automation company. According to its corporate profile, it was the first organization to envision and develop an EM design and verification platform with an integrated EM solver inside the IC design environment. In 2004 the company received major institutional venture capital investment from Telos Venture Partners — the investment group of Cadence Design Systems — and the WK Technology Fund, giving it the backing to build an enterprise-grade EM design platform. From its early years, Lorentz Solution worked closely with key customers, including foundry customers, to develop and validate its platform. The company states that it was the first to achieve EM simulation accuracy up to TeraHz frequencies by making 3D formulation and simulation feasible with a Method of Moments-like algorithm. It also says it was the first company to make EM extraction part of the layout parasitic extraction (LPE) verification flow, through its HFD™ and PLX™ products. As semiconductor process nodes evolved, Lorentz Solution continuously enhanced its EM design platform so that it would blend into other major EDA tools. Its platform integrates with Virtuoso®, Custom Compiler™, Spectre/HSPICE simulators, and Calibre®/Synopsys™/Cadence® layout parasitic extractors/LPE. This integration strategy positioned PeakView® as a complement to established design flows rather than a replacement, allowing designers to add fullwave EM accuracy to existing analog, RF and high-speed flows. Over time the company established PeakView® as its flagship product, describing it as the industry's ultimate EM design, verification and structure simulation solution, heavily used worldwide by top wireless development companies, IDMs and foundries. The product family expanded to cover multiple stages of the EM workflow: EMD™ for parametric synthesis and optimization of on-chip passives; LEM™ for 3D fullwave EM extraction and simulation; and EM Prototyping™, xLEM™ and Combo Cell™ for EM coupling analysis during design verification before tapeout. PeakView® supports both direct solvers for maximum accuracy and iterative solvers for large-scale simulations, includes iRCX and ITF parsers for foundry process technology, and can output S-parameter and RLCK SPICE sub-circuit models for circuit simulation. More recently, Lorentz Solution has stated that it is dedicated to advancing and maintaining its position at the forefront of EM design and sign-off platforms for chiplet and 3DIC technologies for mmWave/TeraHz and AI applications. The company remains privately held and venture-backed, headquartered in Santa Clara, California, and continues to market PeakView® as an EM design and sign-off platform with DC-to-THz accuracy and scalable capacity.

• 2004

  Receives major institutional VC investment from Telos Venture Partners (Cadence Design Systems' investment group) and the WK Technology Fund.

• 2003

  Lorentz Solution, Inc. is founded.

• Becomes the first company to make EM extraction part of the LPE verification flow with its HFD™ and PLX™ products.

• Establishes PeakView® as its flagship EM design, verification and structure simulation platform.

Leading EDA platform for device-, circuit- and system-level EM simulation and sign-off with DC-to-THz accuracy and scalable capacity, targeting RF/mmWave, high-speed/silicon photonics and 3DIC applications.

• PeakView®

  3D fullwave EM design and sign-off platform with DC-to-THz accuracy, scalable capacity, flexible volume meshing, EM isolation noise floor down to -130 dB, direct and iterative solvers, iRCX/ITF foundry parsers, and S-parameter/RLCK SPICE model output.

• EMD™

  Parametric EM device synthesis and optimization of on-chip passive devices and structures, with a synthesis library including T-coils, inductors, multi-layer spirals, transformers, mmWave couplers, co-planar waveguides and photonics transmission lines.

• LEM™

  3D fullwave EM extraction and simulation of customized structures.

• EM Prototyping™

  Tool addressing EM coupling analysis as a key factor during design verification before tapeout.

• xLEM™

  Tool addressing EM coupling analysis as a key factor during design verification before tapeout.

• Combo Cell™

  Tool addressing EM coupling analysis as a key factor during design verification before tapeout.

• HFD™

  Product through which Lorentz Solution first made EM extraction part of the LPE verification flow.

• PLX™

  Product through which Lorentz Solution first made EM extraction part of the LPE verification flow.

1. 1Lorentz Solution official websitelorentzsolution.com
2. 2Corporate Profile – Lorentz Solutionlorentzsolution.com
3. 3Company – Lorentz Solutionlorentzsolution.com
4. 4Products – Lorentz Solutionlorentzsolution.com
5. 5Lorentz Solution, Inc. – Wikidatawikidata.org