Kinsus Interconnect Technology

Kinsus Interconnect Technology is a manufacturer of integrated-circuit packaging substrates headquartered in Xinwu District, Taoyuan City, Taiwan, and is part of the Pegatron Group. Its core product is the IC packaging substrate — the packaging base between the chip and the printed circuit board — which redistributes and enlarges the chip's dense contact points to the pitch a circuit board can accept, and provides electrical connection and mechanical support for the chip. Its official site presents substrate technologies including SiP, PBGA, FCCSP, CSP, RF and FCBGA, and states that it aims to be a global leader in advanced IC substrates, providing customized, one-stop solutions.

Kinsus Interconnect Technology is a manufacturer of integrated-circuit packaging substrates headquartered in Xinwu District, Taoyuan City, Taiwan, and is part of the Pegatron Group. Its core product is the IC packaging substrate, the packaging base between the chip and the printed circuit board, which redistributes and enlarges the chip's dense contact points to the pitch a circuit board can accept, and provides electrical connection and mechanical support for the chip. By ABF substrate capacity, Kinsus is named alongside Unimicron and Nan Ya PCB as Taiwan's "big three" of ABF substrates. On its official site, the company states that since its establishment it has upheld the core ideas of "satisfying customers, pursuing excellence" and "integrity, diligence, thriftiness, and leanness," and that it is committed to becoming a global leader in advanced IC substrates.

Aims to be a global leader in advanced IC substrates, offering customized, one-stop solutions.

• SiP (system in package)

  SiP refers to integrating multiple heterogeneous chips in a single package; applications include multi-chip module (MCM), multi-chip package (MCP), stacked chip packaging, package-in-package (PiP), and embedded-component substrates. It offers IC system designers a functional-integration option besides system-on-chip (SoC).

• PBGA

  PBGA is the most basic ball grid array substrate used in wire-bond packaging; its base material is a copper-clad substrate of resin-impregnated glass fiber. It can be used for chip packaging with a fairly high pin count.

• FCCSP

  As smartphone functionality and network access speeds increase, the pin count required by handset processors rises; flip-chip chip-scale packaging has become the mainstream packaging technology for high-pin-count ICs, especially in general consumer electronics.

• CSP

  Chip-scale packaging has become the main packaging technology for components inside handheld devices, driven by the trend toward thinner and smaller devices.

• RF

  RF module packaging substrates differ somewhat from most digital circuit designs; they require greater design experience and skill and stricter process control to avoid signal interference. Features include strip arrangement, thicker copper traces, impedance control, and strict uniformity control; application areas include smart phones, wearable devices, and wireless devices.

• FCBGA

  AI applications have grown exponentially, and processors used for AI keep upgrading in computing power and integration; flip-chip ball grid array packaging has become the mainstream technology for high-end chips such as GPU and CPU.

1. 1首頁kinsus.com.tw
2. 2產品 - RFkinsus.com.tw
3. 3產品 - CSPkinsus.com.tw
4. 4產品 - SiPkinsus.com.tw
5. 5Kinsus Interconnect Technologywikidata.org
6. 6景碩科技zh.wikipedia.org