Biwin

Biwin (深圳佰维存储科技股份有限公司) is a Chinese semiconductor memory company founded in 2010 and headquartered in Shenzhen. It focuses on the research, design, packaging and testing, production, and sales of semiconductor memory products. The company is listed on the STAR Market of the Shanghai Stock Exchange under the ticker 688525 and is a constituent of the STAR 50 index. Biwin's mission is 'Memory Empowers Everything' (存储赋能万物智联), and it aims to be a world-class storage and advanced packaging and testing provider. Biwin's product portfolio spans embedded storage (eMMC, eMCP, UFS, ePOP, BGA SSD, uMCP, DMMC, SPI NOR Flash), memory (LPDDR5X, LPDDR5, LPDDR4), small-capacity storage (SPI NAND), solid-state drives (Mini SSD, 2.5-inch SATA SSD, U.2 SSD, M.2 SSD, mSATA SSD), memory modules (DDR5 SODIMM, DDR5 UDIMM, DDR4 SODIMM, DDR4 UDIMM), memory cards (CF, CFast, CFexpress, SD), and enterprise-grade SSDs (PCIe 5.0 SSD, 2.5-inch SATA SSD, 2.5-inch U.2 PCIe 4.0 SSD). The company also offers domestic (信创) SSDs and memory modules, and packaging and testing services. Biwin serves six major end markets: mobile storage, intelligent terminals, PC, automotive, data center, and industrial applications. In mobile storage, it holds exclusive operating authorization for HP and Predator brands, offering portable SSDs and overclocked memory modules. In PC applications, it supplies SSDs and memory modules to OEMs such as Lenovo, Tongfang, and Powerleader, as well as to individual consumers. The company has received strategic investments from the National Integrated Circuit Industry Investment Fund Phase II, China Internet Investment Fund, and Chinese Academy of Sciences investments. It operates an integrated R&D and packaging/testing business model, covering storage solution development, controller chip design, memory packaging and testing, wafer-level advanced packaging, and storage testing equipment.

Biwin (深圳佰维存储科技股份有限公司) was founded in 2010 and is headquartered in Shenzhen, China. The company focuses on the research, design, packaging and testing, production, and sales of semiconductor memory products. It has built an integrated R&D and packaging/testing business model, covering storage solution development, controller chip design, memory packaging and testing, wafer-level advanced packaging, and storage testing equipment. Over the years, Biwin has expanded its product portfolio to serve six major end markets: mobile storage, intelligent terminals, PC, automotive, data center, and industrial applications. The company has received strategic investments from the National Integrated Circuit Industry Investment Fund Phase II, China Internet Investment Fund, and Chinese Academy of Sciences investments. It is listed on the STAR Market of the Shanghai Stock Exchange under the ticker 688525 and is a constituent of the STAR 50 index. Biwin has received numerous awards and recognitions, including '2025 Most Valuable STAR Market Listed Company', 'Shanghai Stock Exchange 2024-2025 Information Disclosure Grade A Evaluation', 'Wind ESG Rating AA', and 'Customs AEO Advanced Certified Enterprise'. Its products have won honors such as 'TIME Magazine 2025 Best Inventions', 'Global Electronic Achievement Award Annual Memory', 'China IC Design Achievement Award Annual Best Memory', 'Hardcore China Chip Best Storage Chip', and 'China Automotive Industry Excellent Automotive Electronics Innovation Product Award'.

• 2025

  Biwin received '2025 Most Valuable STAR Market Listed Company' award.

• 2025

  Biwin product won 'TIME Magazine 2025 Best Inventions' award.

• 2024

  Biwin listed on the STAR Market of the Shanghai Stock Exchange under ticker 688525.

• 2024

  Biwin included as a constituent of the STAR 50 index.

• 2010

  Biwin founded in Shenzhen, China.

Storage solutions for the consumer market

• Embedded Storage

  Includes eMMC, eMCP, UFS, ePOP, BGA SSD, uMCP, DMMC, and SPI NOR Flash, widely used in smartphones, tablets, smart wearables, and drones.

• Memory

  Includes LPDDR5X, LPDDR5, and LPDDR4, accelerating high-performance terminal AI applications.

• Solid-State Drives (SSD)

  Includes Mini SSD, 2.5-inch SATA SSD, U.2 SSD, M.2 SSD, and mSATA SSD, supporting PCIe Gen4.0*4 and NVMe 1.4 protocols with read speeds up to 7400MB/s.

• Memory Modules

  Includes DDR5 SODIMM, DDR5 UDIMM, DDR4 SODIMM, and DDR4 UDIMM, with data transfer rates starting from 4800Mbps.

• Memory Cards

  Includes CF, CFast, CFexpress, and SD cards, with CFexpress cards supporting read/write speeds up to 1775MB/s and 1600MB/s respectively.

• Enterprise-Grade SSDs

  Includes PCIe 5.0 SSD, 2.5-inch SATA SSD, and 2.5-inch U.2 PCIe 4.0 SSD, designed for data center and server storage.

• Domestic (信创) SSDs and Memory Modules

  Includes 2.5-inch SATA SSD, M.2 SATA SSD, M.2 NVMe SSD, DDR4 SO-DIMM, and DDR4 U-DIMM for domestic innovation applications.

• Packaging and Testing Services

  Advanced packaging and testing services for embedded storage chips, including BGA, LGA, QFN, SIP, and TSOP packaging forms.

• 2023

  Biwin Storage shares surge abnormally, drawing regulatory letter; faces RMB 50 million patent claim

  After its listing in April 2023, Biwin Storage's share price rose abnormally for consecutive sessions; the Shanghai Stock Exchange issued a regulatory work letter, and the company published a severe abnormal fluctuation announcement warning of risks. In April 2026, the company disclosed that it had received a civil patent infringement complaint from 埃姆梯尔公司, claiming a total of RMB 50 million; the company said it would negotiate under FRAND principles. Regulatory attention; patent litigation ongoing.

  Source

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1. 1首页 - 佰维存储-存储赋能万物智联biwin.com.cn
2. 2公司简介 - 佰维存储-存储赋能万物智联biwin.com.cn
3. 3移动存储 - 佰维存储-存储赋能万物智联biwin.com.cn
4. 4PC应用 - 佰维存储-存储赋能万物智联biwin.com.cn
5. 5Biwin Storage shares surge abnormally, drawing regulatory letter; faces RMB 50 million patent claimwuzi.mbahome.com
6. 6Biwin Storage shares surge abnormally, drawing regulatory letter; faces RMB 50 million patent claimstatic.cninfo.com.cn