ASMPT
ASMPT is a Singapore-headquartered manufacturer of semiconductor and electronics assembly equipment, including die bonders, wire bonders, molding systems, placement equipment, printing systems, and software.
Last updated August 31, 2026
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Overview
ASMPT, formerly known as ASM Pacific Technology, is a Singapore-headquartered technology company that designs and manufactures equipment used in semiconductor packaging and electronics assembly. Its products support manufacturing steps that occur after wafer fabrication, including die bonding, wire bonding, molding, lead-frame production, solder-paste printing, component placement, and increasingly advanced packaging processes. The company also provides software and manufacturing systems associated with electronics production. The business originated from the Asian operations of ASM International, the Netherlands-based semiconductor-equipment group founded by Arthur del Prado. During a 1975 visit to Hong Kong for a meeting with Philips, del Prado assessed the region's semiconductor prospects and established an Asian business with Patrick Lam, an electrical engineer recruited during the visit. The early operation primarily acted as a sales agent for semiconductor materials and encapsulation equipment supplied from the Netherlands and the United States. As its customer base expanded, it moved into local manufacturing. By 1977, it was producing mold bases and custom trim-and-form tools, and in 1979 it acquired industrial property for lead-frame production and purchased a Hong Kong wire-bonder manufacturing business from an American company. ASMPT gradually shifted from distribution and component production toward proprietary equipment engineering. In the early 1980s it recruited engineers to develop automated machinery. A conversion kit introduced in 1981 enabled manual aluminium wire bonders to operate semi-automatically. The company introduced fully automatic wire bonders in 1984 and a die bonder aimed at LED manufacturers in 1985. During the 1980s, lead frames and assembly equipment became important sources of recurring revenue. The company opened a manufacturing plant in Shenzhen at the end of the decade and expanded its research and development footprint in Singapore. To fund expansion, ASMPT went public in Hong Kong in January 1989, with Arthur del Prado as chairman and Patrick Lam as managing director. Over subsequent decades it broadened beyond its original back-end semiconductor equipment base through internal development and acquisitions. Significant transactions included the purchase of Siemens's electronics assembly systems business in 2011, DEK Printing Machines from Dover Corporation in 2014, AMICRA Microtechnologies in 2018, and Critical Manufacturing later in 2018. These moves strengthened the company's position in electronics assembly, advanced packaging, precision placement, printing, and manufacturing software. ASM International progressively reduced its ownership of ASMPT. It was reported to hold a majority stake in the late 1990s, but a 2013 sale reduced its interest below majority control; by 2018, its holding was reported at approximately one quarter. The relationship between the two companies remained historically important, while their distinct corporate identities also became a source of potential confusion. In August 2022, ASM Pacific Technology adopted the shorter ASMPT name to distinguish itself more clearly from ASM International. ASMPT has periodically been the subject of strategic speculation, including reports concerning a possible take-private transaction and interest from private-equity investors. The company has also pursued advanced packaging technologies, including a 2021 collaboration between ASM and EV Group on die-to-wafer bonding for three-dimensional integrated circuits. ASMPT remains focused on equipment and software for semiconductor packaging and electronics manufacturing, serving customers across major Asian and international production centers.
History
ASMPT began in 1975 as the Asian business associated with ASM International. Arthur del Prado, ASM's founder, visited Hong Kong for a customer meeting with Philips and investigated the region's emerging semiconductor industry. He subsequently established an operation with Patrick Lam, an electrical engineer he recruited in Hong Kong. The initial business was largely commercial: it represented semiconductor materials and encapsulation equipment originating from the Netherlands and the United States. The operation soon developed manufacturing capabilities. In 1977 it was producing mold bases and custom trim-and-form tooling. In 1979 it acquired a 10,000-square-foot industrial property to support lead-frame manufacturing and bought a Hong Kong wire-bonder manufacturing business from an American company. These steps gave the company a more substantial industrial base and reduced its dependence on agency sales. In 1980, management began developing proprietary automated equipment and recruited university-trained engineers. A 1981 conversion kit allowed manual aluminium wire bonders to be used semi-automatically. Fully automatic wire bonders followed in 1984, and the company introduced a die bonder for LED manufacturers in 1985. By the end of the 1980s, lead frames and assembly equipment had become two important operating pillars. ASMPT opened a plant in Shenzhen at the end of the decade and increasingly emphasized research and development. Singapore was selected as a major R&D location, supported in part by incentives associated with the Singapore Economic Development Board. Expansion was financed initially through retained earnings and bank borrowing. The company later sought public-market funding and completed an initial public offering in Hong Kong in January 1989. Arthur del Prado became chairman and Patrick Lam managing director. The listing provided capital for continued geographic and technological development. ASMPT broadened its business through acquisitions as semiconductor packaging and electronics assembly became more closely linked. In 2011 it acquired Siemens's electronics assembly systems business. In 2014 it purchased DEK Printing Machines from Dover Corporation. In April 2018 it acquired AMICRA Microtechnologies, and in August 2018 it acquired Critical Manufacturing. Together, these transactions extended the group into printing, precision assembly, advanced packaging, and manufacturing-execution software. ASM International reduced its ownership over time. Its reported holding was 51 percent in 1997, fell after a 2013 sale of 11.9 percent, and was reported at about 25 percent by 2018. The ownership relationship generated strategic discussion, including speculation about a possible divestment, take-private transaction, or later relisting. Reports in 2018 identified potential interest from TCL Technology, while later reports mentioned PAG in 2023 and KKR in 2024. The supplied reference does not confirm that any of these proposals resulted in a completed acquisition. The company continued investing in advanced packaging. In 2021, ASM and EV Group partnered on die-to-wafer bonding techniques for three-dimensional integrated circuits. In August 2022, ASM Pacific Technology changed its corporate name to ASMPT, a move intended in part to distinguish it from ASM International. The company remains an active supplier of semiconductor and electronics assembly equipment and related software, with its historical base in Asia and an international customer and manufacturing footprint.
- 2022
Corporate name changes to ASMPT
[1]ASM Pacific Technology adopted ASMPT as its name to create clearer separation from ASM International.
- 2021
Die-to-wafer bonding partnership
[1]ASM and EV Group partnered to develop die-to-wafer bonding techniques for three-dimensional integrated circuits.
- 2018
AMICRA and Critical Manufacturing join the group
[1]ASMPT acquired AMICRA Microtechnologies in April and Critical Manufacturing in August, expanding its advanced packaging and manufacturing-software activities.
- 2014
DEK Printing Machines acquired
[1]ASMPT purchased DEK Printing Machines from Dover Corporation.
- 2011
Siemens electronics assembly business acquired
[1]ASMPT acquired Siemens's electronics assembly systems business.
- 1989
Hong Kong public listing
[1]ASMPT completed its initial public offering on the Hong Kong Stock Exchange, with Arthur del Prado as chairman and Patrick Lam as managing director.
- 1989
Shenzhen manufacturing plant opens
[1]The company opened a plant in Shenzhen and subsequently placed greater emphasis on research and development in Singapore.
- 1985
First die bonder is produced
[1]The company produced its first die bonder, targeting LED manufacturers.
- 1984
Fully automatic wire bonders introduced
[1]ASMPT launched fully automatic wire-bonding equipment as it shifted toward proprietary automation technology.
- 1981
Semi-automatic wire-bonder conversion kit launches
[1]A conversion kit enabled manual aluminium wire bonders to operate semi-automatically.
Products and positioning
A global semiconductor and electronics assembly equipment supplier combining back-end semiconductor packaging machinery with electronics manufacturing systems, precision printing and placement technologies, and production software.
Semiconductor assembly equipment · 1981
Wire bonders
ASMPT's wire-bonding heritage began with its acquisition of a Hong Kong manufacturing business and progressed from manual-bonder conversion technology to fully automatic systems. Wire bonders connect semiconductor dies to package leads or substrates using fine wires, making them a core part of back-end semiconductor assembly.
Semiconductor assembly equipment · 1985
Die bonders
Die-bonding systems place and attach semiconductor dies to packages, substrates, or other structures. ASMPT produced an early die bonder for LED manufacturers in 1985 and later expanded its precision assembly capabilities through acquisitions such as AMICRA, supporting applications in semiconductor packaging and advanced electronics.
Semiconductor components and tooling · 1977
Lead frames and semiconductor tooling
Lead frames and related trim-and-form tools were among ASMPT's earliest manufactured products. They provide structural and electrical support for packaged semiconductor devices and helped establish the company's initial manufacturing base before its greater emphasis on automated equipment and research and development.
Electronics assembly equipment
DEK printing systems
The DEK product line supplies printing systems used in electronics assembly, particularly for depositing solder paste and other materials onto circuit-board substrates. ASMPT added this capability through its 2014 acquisition of DEK Printing Machines from Dover Corporation.
Electronics manufacturing equipment · 2011
Electronics assembly systems
ASMPT's electronics assembly systems support automated production of electronic assemblies, including placement and related process steps. This business became part of the group through the 2011 acquisition of Siemens's electronics assembly systems operation and complements the company's semiconductor-packaging equipment.
Industrial software · 2018
Manufacturing software
Through Critical Manufacturing, ASMPT offers manufacturing software associated with digital production management and manufacturing-execution processes. The software activity extends the group beyond machinery by helping electronics and semiconductor manufacturers coordinate, monitor, and control production operations.
Brand decisions
2022
Adoption of the ASMPT brandStrategyBackground
The former ASM Pacific Technology name could be confused with ASM International, the historically related company.
Action taken
The company changed its name to ASMPT.
Aftermath
The shorter name provided a clearer corporate identity while retaining the established ASM association.
2018
Expansion through AMICRA and Critical ManufacturingM&ABackground
ASMPT aimed to extend its capabilities in precision assembly, advanced packaging, and digital manufacturing.
Action taken
The company acquired AMICRA Microtechnologies in April and Critical Manufacturing in August.
Aftermath
The acquisitions added advanced packaging equipment and manufacturing-execution software capabilities.
2014
Acquisition of DEK Printing MachinesM&ABackground
Printing technology is a key process in electronics assembly and complements placement and other automated production equipment.
Action taken
ASMPT acquired DEK Printing Machines from Dover Corporation.
Aftermath
DEK became part of ASMPT's electronics assembly offering.
2011
Acquisition of Siemens electronics assembly systemsM&ABackground
ASMPT sought to strengthen its position in electronics assembly in addition to its semiconductor back-end equipment business.
Action taken
It acquired the electronics assembly systems business of Siemens.
Aftermath
The transaction broadened ASMPT's electronics manufacturing equipment portfolio.
1989
Pursuit of public-market fundingStrategyBackground
ASMPT had previously funded growth mainly through retained earnings and bank loans, but sought additional capital to support expansion.
Action taken
The company completed an initial public offering and listed on the Hong Kong Stock Exchange in January 1989.
Aftermath
The listing provided a broader funding base for geographic expansion, manufacturing, and equipment development.
Recent events
Saki and ASMPT announce smart-factory partnership[2]
Reported:
Saki Corporation and ASMPT announced a collaboration to enable machine connectivity between Saki inspection and measurement systems and ASMPT pick-and-place machines using IPC Connected Factory Exchange.
City University of Hong Kong and technology companies establish joint laboratories[3]
City University of Hong Kong's Department of Electrical Engineering and six technology companies announced the establishment of joint laboratories to promote research and technology transfer.
Sources3 sources
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