ASE Technology Holding Co., Ltd.
Taiwanese semiconductor packaging and testing giant formed by the 2018 merger of Advanced Semiconductor Engineering and Siliconware Precision Industries.
Last updated October 30, 2026
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Overview
ASE Technology Holding Co., Ltd. (日月光投控) is a Taiwanese semiconductor assembly, testing and packaging (OSAT) group and one of the largest outsourced semiconductor assembly and test providers in the world. It was created in 2018 as a holding company when Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) combined, creating a global leader in chip packaging and testing services. The group is headquartered in Kaohsiung, Taiwan, and is listed on the Taiwan Stock Exchange under ticker 3711, with American Depositary Shares traded on the New York Stock Exchange under the symbol ASX. The company's business spans semiconductor packaging, testing, and electronic manufacturing services (EMS) through its subsidiaries, including ASE Inc., SPIL, and USI (Universal Scientific Industrial). ASE Technology Holding serves fabless chip designers, foundries, and integrated device manufacturers across logic, memory, analog, and mixed-signal segments, with a strong position in advanced packaging technologies such as flip-chip, wafer-level packaging, system-in-package (SiP), and fan-out packaging used in smartphones, high-performance computing, and automotive electronics. ASE Group operates manufacturing and service sites across Taiwan, mainland China, South Korea, Japan, Singapore, Malaysia, and the United States, and is a key supplier to major global semiconductor companies. The holding structure was designed to realize synergies between ASE and SPIL while maintaining separate operating subsidiaries. The group is a major player in the global OSAT market alongside Amkor Technology and China's JCET, and has invested heavily in advanced packaging capacity to capture demand from AI, 5G, and automotive applications. As a corporate brand, ASE Technology Holding represents the combined scale, technology portfolio, and customer relationships of its founding companies, positioning itself as a one-stop provider of semiconductor packaging, testing, and system-level manufacturing services.
History
ASE Technology Holding Co., Ltd. was formed in 2018 through the combination of Advanced Semiconductor Engineering, Inc. (ASE) and Siliconware Precision Industries Co., Ltd. (SPIL), two of Taiwan's leading semiconductor packaging and testing companies. The transaction created a holding company structure designed to preserve the operating independence of both subsidiaries while capturing synergies in procurement, capacity planning, and technology development. Advanced Semiconductor Engineering was founded in 1984 in Kaohsiung, Taiwan, and grew into one of the world's largest independent semiconductor packaging and testing service providers. Siliconware Precision Industries was founded in 1984 in Taichung, Taiwan, and became a major competitor in packaging and testing services. The two companies announced their intention to combine in 2016, and the holding company structure was completed in 2018, with ASE Technology Holding listed on the Taiwan Stock Exchange. The group has continued to invest in advanced packaging technologies, including fan-out wafer-level packaging, system-in-package, and 2.5D/3D integration, to serve demand from mobile, high-performance computing, and automotive markets. Its subsidiary USI (Universal Scientific Industrial) provides electronic manufacturing services and system-level assembly. The company operates manufacturing sites across Taiwan, mainland China, South Korea, Japan, Singapore, Malaysia, and the United States, and serves a global customer base of semiconductor companies.
- 2018
ASE Technology Holding Co., Ltd. formed as holding company and listed on the Taiwan Stock Exchange.
- 2016
ASE and SPIL announce plan to combine.
- 1984
Advanced Semiconductor Engineering founded in Kaohsiung, Taiwan.
- 1984
Siliconware Precision Industries founded in Taichung, Taiwan.
Products and positioning
Advanced packaging (flip-chip, WLCSP, fan-out)
System-in-Package (SiP)
Semiconductor testing services
Electronic manufacturing services (USI)
Recent events
SEMI Taiwan launches semiconductor materials alliance[2]
Reported:
SEMI Taiwan launched the SEMI Taiwan Materials Alliance on August 21, 2026, to strengthen semiconductor materials supply chain resilience. More than 30 firms joined, including ASE Technology Holding, GlobalWafers, LCY Chemical Corp and Advanced Echem Materials Co.
ASE announces proposed sale of subsidiary equity interests to Wise Road Capital[3]
Reported:
ASE announced an agreement to sell equity interests in GAPT Holding Limited and ASE (Kun Shan) Inc. to Wise Road Capital or its designated affiliate for aggregate cash consideration of US$1.46 billion. The transaction was proposed; the source says the shares would transfer on a later completion date.
Sources4 sources
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