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Yangtze Memory Technologies

Recent events

Recent events tied to this brand in public sources.

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  1. 2026

    Yangtze Memory Technologies' STAR Market IPO application accepted

    Yangtze Memory Technologies Holding Co., Ltd., a Chinese 3D NAND storage maker, had its STAR Market IPO application accepted by the Shanghai Stock Exchange on August 21, 2026, with a planned fundraising of 33 billion yuan, the largest since the STAR Market opened.

  2. 2021

    致态 TiPro7000 SSD launch

    Yangtze Memory announced the consumer flagship TiPro7000 solid-state drive on December 29, 2021. It supports PCIe Gen4x4 and NVMe 1.4 and has sequential read speeds of up to 7400 MB/s; presales were scheduled to begin December 30 and formal sales December 31.

  3. 2021

    Yangtze Memory upgrades its consumer brand to 致态

    Yangtze Memory said its consumer brand had been upgraded to 致态 alongside the introduction of its new flagship TiPro7000 product. New products would use the 致态 brand, while three earlier products would continue using 致钛.

  4. 2020

    Yangtze Memory announces the ZHITAI SSD brand

    Yangtze Memory announced the launch of its ZHITAI SSD brand. It said the brand will provide 3D NAND flash products and solutions; SSD products under the brand are planned for the future.

  5. 2020

    Guokewei previews SSD using Yangtze Memory 64-layer 3D NAND

    At the signing ceremony for the supply agreement, Guokewei previewed a solid-state drive equipped with Yangtze Memory 64-layer 3D NAND chips.

  6. 2020

    Guokewei and Yangtze Memory sign long-term supply agreement

    Guokewei and Yangtze Memory signed a long-term supply agreement in Changsha, Hunan.

  7. 2020

    Phison and YMTC collaborate on 3D NAND support

    Phison announced that its full range of NAND controller chips supported Yangtze Memory Technologies' 3D NAND and had entered mass production; the report also describes the companies' collaboration on storage applications.

  8. 2020

    Yangtze Memory introduces X2-6070 128-layer QLC flash

    Yangtze Memory introduced its X2-6070 128-layer QLC 3D NAND flash chip, with a stated capacity of 1.33Tb per chip.