Recent events
Recent events tied to this brand in public sources.
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2026
FCC bars two devices containing HiSilicon chips from the U.S. market
The U.S. Federal Communications Commission said it had barred two devices—a dashcam and a wireless video transmitter—containing surveillance chips produced by Huawei subsidiary HiSilicon from entering the U.S. market. The FCC said the action was its first enforcement under a new rule that took effect on October 13.
2026
Edifier launches Comfo Clip Q2 clip-on earbuds
Edifier launched the Comfo Clip Q2 smart clip-on earbuds on August 25, 2026, with a pre-sale price of 399 yuan. The earbuds run a domestic operating system built on OpenHarmony and use a HiSilicon audio chip, and feature a 12mm dynamic driver, 0.05-second low-latency transmission, AI translation via Doubao and DeepSeek models, and up to 40.5 hours of total battery life with the charging case.
2021
Jintuo and Hisilicon sign cooperation memorandum
Jintuo announced that it had signed a cooperation memorandum with Hisilicon to expand cooperation in semiconductor packaging equipment.
2020
康佳芯盈 eMMC products receive HiSilicon platform certification
康佳芯盈's eMMC products successfully ran on the HiSilicon processor platform and received platform certification; the article says they passed validation on multiple HiSilicon television processor platforms.
2020
HiSilicon introduces two FHD smart-TV chips
Huawei’s HiSilicon introduced two pin-to-pin-compatible FHD smart-TV chips, one with 512 MB of built-in memory and the other with 1 GB. The report says the 512 MB chip can run Android P (9.0).
2020
HiSilicon launches XR chip platform
HiSilicon launched an XR chip platform; the article identifies Rokid Vision as the platform’s first product.
2020
HiSilicon begins supplying chips beyond Huawei
HiSilicon, Huawei’s chip company, began supplying chips to companies other than Huawei and entered the public market with a 4G communications chip.