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HiSilicon

Controversies

Controversies tied to this brand in public sources. A listing is not a finding of fault.

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  1. 2026

    FCC bars two devices containing HiSilicon chips from the U.S. market

    Ban or restriction

    The U.S. Federal Communications Commission said it had barred two devices—a dashcam and a wireless video transmitter—containing surveillance chips produced by Huawei subsidiary HiSilicon from entering the U.S. market. The FCC said the action was its first enforcement under a new rule that took effect on October 13.

    Source excerpt

    • FCC指出，这两款设备都采用了华为子公司海思(HiSilicon)生产的芯片。
    • 美国联邦通信委员会(FCC)星期四表示，已禁止两款含有华为子公司生产的外国监控芯片的设备进入美国市场。
    • FCC表示，这是根据7月份通过的，10月13日生效的一项新规进行的首例执法行动。
    Source

  2. 2019

    Huawei and HiSilicon added to the U.S. Entity List; 'spare tire' chips brought into service

    In May 2019, the U.S. Department of Commerce added Huawei and about 70 affiliates, including HiSilicon, to the export-control Entity List. HiSilicon president Teresa He Tingbo issued an internal letter saying the 'spare tire' chips built up over the years were 'all brought into service overnight.' In 2020 the United States further restricted foundries using U.S. technology from manufacturing chips for Huawei, TSMC stopped making chips for HiSilicon, and high-end Kirin chips were cut off for a time. HiSilicon's revenue fell sharply and Huawei's handset business was hit hard; the company subsequently pushed domestic substitution.

    Source